U.S. patent number D514,913 [Application Number D/199,158] was granted by the patent office on 2006-02-14 for three-dimensional modeling substrate.
This patent grant is currently assigned to Stratasys, Inc.. Invention is credited to Benjamin N. Dunn, Jerome W. Goetzke.
United States Patent |
D514,913 |
Dunn , et al. |
February 14, 2006 |
Three-dimensional modeling substrate
Claims
CLAIM The ornamental design for a three-dimensional modeling
substrate, as shown.
Inventors: |
Dunn; Benjamin N. (Savage,
MN), Goetzke; Jerome W. (Oakdale, MN) |
Assignee: |
Stratasys, Inc. (Eden Prairie,
MN)
|
Appl.
No.: |
D/199,158 |
Filed: |
February 10, 2004 |
Current U.S.
Class: |
D8/71 |
Current International
Class: |
0805 |
Field of
Search: |
;D8/71,14,70,72,73,74,349,354,373,395 ;D6/553,406.3,406.5,406.6
;D15/130,132,138,139,140,141 ;173/132 ;206/349 ;211/70.1,70.6
;248/127,146,156 ;269/291 ;700/162 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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|
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1015629 |
|
Oct 1983 |
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GB |
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62-206840 |
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Sep 1987 |
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JP |
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02-015927 |
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Jan 1990 |
|
JP |
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Primary Examiner: Watson; Gary D.
Assistant Examiner: Nelson; T. Chase
Attorney, Agent or Firm: Kinney & Lange, P.A.
Description
FIG. 1 is a perspective view of a three-dimensional modeling
substrate, showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a right side view thereof thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a left side view thereof; and,
FIG. 7 is a bottom perspective view thereof.
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