Three-dimensional modeling substrate

Dunn , et al. February 14, 2

Patent Grant D514913

U.S. patent number D514,913 [Application Number D/199,158] was granted by the patent office on 2006-02-14 for three-dimensional modeling substrate. This patent grant is currently assigned to Stratasys, Inc.. Invention is credited to Benjamin N. Dunn, Jerome W. Goetzke.


United States Patent D514,913
Dunn ,   et al. February 14, 2006

Three-dimensional modeling substrate

Claims

CLAIM The ornamental design for a three-dimensional modeling substrate, as shown.
Inventors: Dunn; Benjamin N. (Savage, MN), Goetzke; Jerome W. (Oakdale, MN)
Assignee: Stratasys, Inc. (Eden Prairie, MN)
Appl. No.: D/199,158
Filed: February 10, 2004

Current U.S. Class: D8/71
Current International Class: 0805
Field of Search: ;D8/71,14,70,72,73,74,349,354,373,395 ;D6/553,406.3,406.5,406.6 ;D15/130,132,138,139,140,141 ;173/132 ;206/349 ;211/70.1,70.6 ;248/127,146,156 ;269/291 ;700/162

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Primary Examiner: Watson; Gary D.
Assistant Examiner: Nelson; T. Chase
Attorney, Agent or Firm: Kinney & Lange, P.A.

Description



FIG. 1 is a perspective view of a three-dimensional modeling substrate, showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a right side view thereof thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a left side view thereof; and,

FIG. 7 is a bottom perspective view thereof.

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