Housing for an electronic circuit module

Hahn , et al. January 31, 2

Patent Grant D514075

U.S. patent number D514,075 [Application Number D/195,849] was granted by the patent office on 2006-01-31 for housing for an electronic circuit module. This patent grant is currently assigned to Honeywell International Inc.. Invention is credited to Rod P. Boer, Amand J. Hahn, Eric A. Schneider.


United States Patent D514,075
Hahn ,   et al. January 31, 2006

Housing for an electronic circuit module

Claims

CLAIM The ornamental design for a housing for an electronic circuit module, as shown and described.
Inventors: Hahn; Amand J. (Lansdale, PA), Boer; Rod P. (Hartboro, PA), Schneider; Eric A. (Erdenheim, PA)
Assignee: Honeywell International Inc. (Morristown, NJ)
Appl. No.: D/195,849
Filed: December 18, 2003

Current U.S. Class: D13/184
Current International Class: 1303
Field of Search: ;D13/184 ;D14/240 ;174/50,52.1 ;220/4.02 ;361/600,601,679,688,704,724,796

References Cited [Referenced By]

U.S. Patent Documents
5842514 December 1998 Zapach et al.
6625017 September 2003 Lin et al.
6628521 September 2003 Gustine et al.
6649830 November 2003 Bartlett et al.
Primary Examiner: Reid; Stella
Assistant Examiner: Sikder; Selina
Attorney, Agent or Firm: Miologos; Anthony

Description



The housing for an electronic circuit module is intended to be used to house electronic circuit board and their included electronic components and other electronic circuitry.

FIG. 1 is a right side perspective view of the housing for an electronic circuit module embodying our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a left side elevational view thereof

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.

The broken line disclosures in the drawings are for illustrative purposes only and form no part of the claimed design.

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