Optoelectronic IC package

Description

FIG. 1 is a top perspective view of an optoelectronic IC package of the present invention;

FIG. 2 is a first side view thereof;

FIG. 3 is a second side view thereof;

FIG. 4 is a third side view thereof;

FIG. 5 is a top view thereof; and,

FIG. 6 is a fourth side view thereof.

The ornamental design which is claimed is shown in solid lines in the drawings. Any broken lines in the drawings are for illustrative purposes only and form no part of the claimed design.

Claims

We claim the ornamental design for an optoelectronic IC package, as shown and described.

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Inventors:	Horinouchi; Shogo (Fukuoka, JP), Ohyama; Hideki (Fukuoka, JP)
Assignee:	Matsushita Electric Industrial Co., Ltd. (Osaka, JP)
Appl. No.:	D/191,635
Filed:	October 10, 2003

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Foreign Application Priority Data

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Jul 9, 2003 [JP]			2003-019764

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;174/52.1 ;257/79,81,82,98,99,100,436,690 ;362/800 ;385/92 ;438/29

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References Cited [Referenced By]

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U.S. Patent Documents

5218223	June 1993	Spaeth et al.
5679976	October 1997	Nishikawa et al.
D432097	October 2000	Song et al.
6328483	December 2001	Havasi et al.
6355946	March 2002	Ishinaga
6570190	May 2003	Krames et al.
D476961	July 2003	Horiuchi et al.
6642449	November 2003	Gotoh et al.
6707069	March 2004	Song et al.
2001/0040300	November 2001	Huang et al.
2004/0201987	October 2004	Omata

Foreign Patent Documents

	D1144892		Jun 2002		JP
	D1144893		Jun 2002		JP
	D1145109		Jun 2002		JP

Primary Examiner: Reid; Stella
Assistant Examiner: Sikder; Selina
Attorney, Agent or Firm: Brinks Hofer Gilson & Lione