Housing for a sensor assembly

Schwarz January 11, 2

Patent Grant D500688

U.S. patent number D500,688 [Application Number D/191,063] was granted by the patent office on 2005-01-11 for housing for a sensor assembly. This patent grant is currently assigned to Rockwell Automation Technologies, Inc.. Invention is credited to Reinhard Schwarz.


United States Patent D500,688
Schwarz January 11, 2005

Housing for a sensor assembly

Claims

The ornamental design for a housing for a sensor assembly, as shown and described.
Inventors: Schwarz; Reinhard (Eggelsberg, AT)
Assignee: Rockwell Automation Technologies, Inc. (Mayfield Heights, OH)
Appl. No.: D/191,063
Filed: September 30, 2003

Current U.S. Class: D10/46
Current International Class: 1004
Field of Search: ;D10/46,78 ;250/221

References Cited [Referenced By]

U.S. Patent Documents
5015840 May 1991 Blau
6297498 October 2001 Shteynberg et al.
2003/0071197 April 2003 Sugiyama
2003/0106992 June 2003 Koyama et al.
Primary Examiner: Davis; Antoine D.
Attorney, Agent or Firm: Schwegman Lundberg Woessner & Kluth Walbrun; William R.

Description



FIG. 1 is a perspective view of a housing for a sensor assembly in accordance with one embodiment.

FIG. 2 is a front elevational view of the housing for a sensor assembly of FIG. 1.

FIG. 3 is a first end view of the housing for a sensor assembly of FIG. 1.

FIG. 4 is a first side elevational view of the housing for a sensor assembly of FIG. 1.

FIG. 5 is a back elevational view of the housing for a sensor assembly of FIG. 1.

FIG. 6 is a second end view of the housing for a sensor assembly of FIG. 1; and,

FIG. 7 is a second side elevational view of the housing for a sensor assembly of FIG. 1.

The broken line showing is for illustrative purposes only and forms no part of the claimed design.

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