U.S. patent number D496,859 [Application Number D/194,640] was granted by the patent office on 2004-10-05 for package.
This patent grant is currently assigned to Matsushita Electric Industrial Co., Ltd.. Invention is credited to Shinsuke Hamuro, Kunio Hoshino.
United States Patent |
D496,859 |
Hamuro , et al. |
October 5, 2004 |
Package
Claims
The ornamental design for a package, as shown and described.
Inventors: |
Hamuro; Shinsuke (Ikoma,
JP), Hoshino; Kunio (Kusatsu, JP) |
Assignee: |
Matsushita Electric Industrial Co.,
Ltd. (Osaka, JP)
|
Appl.
No.: |
D/194,640 |
Filed: |
November 26, 2003 |
Foreign Application Priority Data
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|
|
|
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Jun 30, 2003 [JP] |
|
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2003-015276 |
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Current U.S.
Class: |
D9/432 |
Current International
Class: |
0903 |
Field of
Search: |
;D9/432,414,423,433,499
;206/459.1,459.5,525,527 ;229/100,103.3,124,153,800 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Deshmukh; Prabhakar
Assistant Examiner: Bui; Daniel
Attorney, Agent or Firm: Brinks Hofer Gilson & Lione
Description
The patent file contains at least one drawing executed in color.
Copies of this patent with color drawings will be provided by the
United States Patent and Trademark Office upon request and payment
of the necessary fee.
FIG. 1 is a top perspective view of a package of the present
invention;
FIG. 2 is a front view thereof, wherein the rear view is a mirror
image thereof;
FIG. 3 is a right side view thereof, wherein the left side view is
a mirror image thereof;
FIG. 4 is a top view thereof; and,
FIG. 5 is a bottom view thereof.
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