Heat sink

Tsai , et al. September 14, 2

Patent Grant D496006

U.S. patent number D496,006 [Application Number D/167,276] was granted by the patent office on 2004-09-14 for heat sink. This patent grant is currently assigned to DaTech Technology Co., Ltd.. Invention is credited to Ping Tsang Ho, Ching-Feng Tsai.


United States Patent D496,006
Tsai ,   et al. September 14, 2004

Heat sink

Claims

The ornamental design for a heat sink, as shown and described.
Inventors: Tsai; Ching-Feng (Taipei, TW), Ho; Ping Tsang (Taipei, TW)
Assignee: DaTech Technology Co., Ltd. (Taipei Hsien, TW)
Appl. No.: D/167,276
Filed: September 12, 2002

Foreign Application Priority Data

Aug 16, 2002 [TW] 91304506
Aug 27, 2002 [TW] 91213373 U
Current U.S. Class: D13/179
Current International Class: 1303
Field of Search: ;D13/179 ;165/80.3,104.14,104.33,121,122,180,185 ;174/16.3,52.4 ;206/713,714,715,716,727,728 ;297/706,707,718,719,720,722,727,686 ;361/271,274.3,697,702,704,709,710,711

References Cited [Referenced By]

U.S. Patent Documents
5558155 September 1996 Ito
5761811 June 1998 Ito
6104609 August 2000 Chen
6340056 January 2002 Huang et al.
6474407 November 2002 Chang et al.
6487079 November 2002 Katsui
Primary Examiner: Hyder; Philip S.
Assistant Examiner: Sikder; Selina
Attorney, Agent or Firm: Troxell Law Office PLLC

Description



FIG. 1 is a perspective view of a heat sink, in accordance with the present invention, the enlarged detail is shown for ease of illustration;

FIG. 2 is a front elevational view thereof, the enlarged detail is shown for ease of illustration;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof, the enlarged detail is shown for ease of illustration; and,

FIG. 7 is a bottom plane view thereof.

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