U.S. patent number D493,151 [Application Number D/179,828] was granted by the patent office on 2004-07-20 for heat-conducting block of vga chipset cooling device.
This patent grant is currently assigned to Zalman Tech Co., Ltd.. Invention is credited to Sang-cheol Lee.
United States Patent |
D493,151 |
Lee |
July 20, 2004 |
Heat-conducting block of VGA chipset cooling device
Claims
I claim the ornamental design for a heat-conducting block of VGA
chipset cooling device, as shown and described in the attached six
drawings.
Inventors: |
Lee; Sang-cheol (Kunpo-si,
KR) |
Assignee: |
Zalman Tech Co., Ltd.
(Gumchun-gu, KR)
|
Appl.
No.: |
D/179,828 |
Filed: |
April 15, 2003 |
Foreign Application Priority Data
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|
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Nov 11, 2002 [KR] |
|
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30-2002-0032025 |
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Current U.S.
Class: |
D13/179 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/179
;361/688,696-97,700,709 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Vinson; Brian N
Attorney, Agent or Firm: St. Onge Steward Johnston &
Reens LLC
Description
FIG. 1 is a perspective view of a heat-conducting block of VGA
chipset cooling device according to the present invention.
FIG. 2 is a front view of the heat-conducting block according to
the present invention; the rear view of the heat-conducting block
is a mirror image of FIG. 2.
FIG. 3 is a right side view of the heat-conducting block according
to the present invention; the left side view of the heat-conducting
block is a mirror image of FIG. 3.
FIG. 4 is a top plan view of the heat-conducting block according to
the present invention.
FIG. 5 is a bottom plan view of the heat-conducting block according
to the present invention; and,
FIG. 6 is a perspective view illustrating use of the
heat-conducting block according to the present invention.
The broken lines in the figures indicate environmental elements for
illustrative purposes only and form no part of the claimed
design.
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