Interphone

Matsui , et al. June 15, 2

Patent Grant D491551

U.S. patent number D491,551 [Application Number D/173,554] was granted by the patent office on 2004-06-15 for interphone. This patent grant is currently assigned to Aiphone Co., Ltd.. Invention is credited to Toshio Hotta, Hiroshi Matsui.


United States Patent D491,551
Matsui ,   et al. June 15, 2004

Interphone

Claims

The ornamental design for an interphone, as shown and described.
Inventors: Matsui; Hiroshi (Nagoya, JP), Hotta; Toshio (Tokai, JP)
Assignee: Aiphone Co., Ltd. (Aichi-ken, JP)
Appl. No.: D/173,554
Filed: January 2, 2003

Foreign Application Priority Data

Jul 5, 2002 [JP] 2002-018172
Jul 5, 2002 [JP] 2002-018173
Current U.S. Class: D14/159
Current International Class: 1403
Field of Search: ;D10/104,106 ;D14/142,146,155,158,159,243,299 ;340/539,571-573 ;342/419,450 ;379/167.05,167.14

References Cited [Referenced By]

U.S. Patent Documents
D283130 March 1986 Boenning
4809320 February 1989 Hawkins et al.
D313592 January 1991 Morooka
D321686 November 1991 Plozner
D466491 December 2002 Matsui et al.
D466882 December 2002 Matsui et al.
Foreign Patent Documents
749954 Aug 1988 JP
1012221 Mar 1998 JP

Other References

Aiphone Kommunikations-Systeme 2002, Extract from Catalogue, pp. 30-31..

Primary Examiner: Bondade; Nanda
Attorney, Agent or Firm: Birch, Stewart, Kolasch & Birch, LLP

Description



FIG. 1 is a perspective view of an interphone showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a perspective view illustrating a second embodiment of the present invention;

FIG. 9 is a front elevational view thereof;

FIG. 10 is a rear elevational view thereof

FIG. 11 is a left side elevational view thereof;

FIG. 12 is a right side elevational view thereof;

FIG. 13 is a top plan view thereof; and,

FIG. 14 is a bottom plan view thereof.

* * * * *


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