U.S. patent number D491,551 [Application Number D/173,554] was granted by the patent office on 2004-06-15 for interphone.
This patent grant is currently assigned to Aiphone Co., Ltd.. Invention is credited to Toshio Hotta, Hiroshi Matsui.
United States Patent |
D491,551 |
Matsui , et al. |
June 15, 2004 |
Interphone
Claims
The ornamental design for an interphone, as shown and described.
Inventors: |
Matsui; Hiroshi (Nagoya,
JP), Hotta; Toshio (Tokai, JP) |
Assignee: |
Aiphone Co., Ltd. (Aichi-ken,
JP)
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Appl.
No.: |
D/173,554 |
Filed: |
January 2, 2003 |
Foreign Application Priority Data
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Jul 5, 2002 [JP] |
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2002-018172 |
Jul 5, 2002 [JP] |
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2002-018173 |
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Current U.S.
Class: |
D14/159 |
Current International
Class: |
1403 |
Field of
Search: |
;D10/104,106
;D14/142,146,155,158,159,243,299 ;340/539,571-573 ;342/419,450
;379/167.05,167.14 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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749954 |
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Aug 1988 |
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JP |
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1012221 |
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Mar 1998 |
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JP |
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Other References
Aiphone Kommunikations-Systeme 2002, Extract from Catalogue, pp.
30-31..
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Primary Examiner: Bondade; Nanda
Attorney, Agent or Firm: Birch, Stewart, Kolasch &
Birch, LLP
Description
FIG. 1 is a perspective view of an interphone showing our new
design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a perspective view illustrating a second embodiment of
the present invention;
FIG. 9 is a front elevational view thereof;
FIG. 10 is a rear elevational view thereof
FIG. 11 is a left side elevational view thereof;
FIG. 12 is a right side elevational view thereof;
FIG. 13 is a top plan view thereof; and,
FIG. 14 is a bottom plan view thereof.
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