U.S. patent number D488,177 [Application Number D/177,991] was granted by the patent office on 2004-04-06 for apparatus for melting and dispensing of material. This patent grant is currently assigned to Nordson Corporation. Invention is credited to Ralf Dittmann, Kai Herda, Harald Meyer, Jirka Trhlik, Kay-Uwe Witte.
United States Patent | D488,177 |
Dittmann , et al. | April 6, 2004 |
Inventors: | Dittmann; Ralf (Melbek, DE), Meyer; Harald (Betzendorf, DE), Trhlik; Jirka (Frankfurt, DE), Witte; Kay-Uwe (Offenbach, DE), Herda; Kai (Hessen, DE) |
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Assignee: | Nordson Corporation (Westlake,
OH) |
Appl. No.: | D/177,991 |
Filed: | March 19, 2003 |
Current U.S. Class: | D15/144 |
Current International Class: | 1509 |
Field of Search: | ;D15/144,144.2,144.3 ;222/146.5 ;219/687,730,759,762 |
D270353 | August 1983 | Lewellen |
4456151 | June 1984 | Lewellen |
D276617 | December 1984 | Scholl et al. |
D360422 | July 1995 | Frates et al. |
D425530 | May 2000 | Lafitte |
Airprint Systems, Inc., NCG Hotmelt Equipment, Brochure, 2 pgs., undated. . Valco Cincinnati, The Valco Hot Melt System, Brochure,3 pgs., undated. . ITW Dynatec, Packaging Newsline, Brochure, 2 pgs., undated. . Slautterback, Hotmelt Applicator Systems, Brochure, 18 pgs., 1996. . Nordson Corporation, 1996 Adhesives and Sealants Equipment Catalog, 1996, pp. 1-1 to 1-84, 2-i to 2-0; and 13-20.. |
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