Electronics component assembly
Dang , et al. January 20, 2
U.S. patent number D485,536 [Application Number D/177,597] was granted by the patent office on 2004-01-20 for electronics component assembly. This patent grant is currently assigned to Pulse Engineering, Inc.. Invention is credited to Glen Alan Cotant, Tung Dang.
| United States Patent | D485,536 |
| Dang , et al. | January 20, 2004 |
Electronics component assembly
Claims
The ornamental design of an electronics component assembly, as shown and described.
| Inventors: | Dang; Tung (San Marcos, CA), Cotant; Glen Alan (Ramona, CA) |
|---|---|
| Assignee: | Pulse Engineering, Inc. (San
Diego, CA) |
| Appl. No.: | D/177,597 |
| Filed: | March 10, 2003 |
| Current U.S. Class: | D13/182 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/182 ;29/602.1 ;174/17VA ;200/306 ;220/260 ;335/78,80,122,132,151,199,202 ;361/626,633,819 ;439/362,564,709,710,715,716 |
References Cited [Referenced By]
U.S. Patent Documents
| 3638149 | January 1972 | Bopp et al. |
| 4292614 | September 1981 | Ono et al. |
| 4507633 | March 1985 | Minks |
| 4924213 | May 1990 | Decho et al. |
| 5438307 | August 1995 | Chou |
| 5801930 | September 1998 | Dittmann |
| 6549108 | April 2003 | Fausch |
Other References
|
Allied Electronics, 1990, pp. 402 (upper left), 615 (upper right and middle left).. |
Primary Examiner: Bondade; Nanda
Assistant Examiner: Sikder; Selina
Attorney, Agent or Firm: Gazdzinski & Associates
Description
FIG. 1 is a side elevation view of a first embodiment of an electronics component package, showing our new design;
FIG. 2 is a bottom plan view thereof;
FIG. 3 is a front elevation view thereof;
FIG. 4 is a side elevation view of a second embodiment of an electronics component package, showing our new design;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a front elevation view thereof.
The broken lines depict environmental structure and form no part of the claimed design.
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