Clip for securing a heat-dissipating module Patent Grant Hsia , et al. December 9, 2 [Delta Electronics Inc.]

Clip for securing a heat-dissipating module

Hsia , et al. December 9, 2

Patent Grant D483469

U.S. patent number D483,469 [Application Number D/171,548] was granted by the patent office on 2003-12-09 for clip for securing a heat-dissipating module. This patent grant is currently assigned to Delta Electronics Inc.. Invention is credited to Chih-Hao Hsia, Wen-Shi Huang, Kuo-Cheng Lin.

United States Patent	D483,469
Hsia , et al.	December 9, 2003

Clip for securing a heat-dissipating module

Claims

The ornamental design for clip for securing a heat-dissipating module, as shown and described herein.

Inventors:	Hsia; Chih-Hao (Banqiao, TW), Lin; Kuo-Cheng (Taoyuan, TW), Huang; Wen-Shi (Taoyuan, TW)
Assignee:	Delta Electronics Inc. (Taoyuan Hsien, TW)
Appl. No.:	D/171,548
Filed:	November 25, 2002

Foreign Application Priority Data


Sep 13, 2002 [TW]			91305156

Current U.S. Class:	D23/411
Current International Class:	2304
Field of Search:	;D23/411,370,379 ;248/500,505,694 ;361/695,697,707 ;257/718,719,726 ;24/295,296

References Cited [Referenced By]

U.S. Patent Documents


D461238	August 2002	Horng
6435467	August 2002	Lai
6456493	September 2002	Lee
D470585	February 2003	Lee

Primary Examiner: Lichtenstein; Lisa
Attorney, Agent or Firm: Birch, Stewart, Kolasch & Birch, LLP

Description

FIG. 1 is a perspective view of clip for securing a heat-dissipating module showing our new design;

FIG. 2 is a right side view thereof;

FIG. 3 is a top view thereof;

FIG. 4 is a front view thereof;

FIG. 5 is a bottom view thereof;

FIG. 6 is a left side view thereof; and,

FIG. 7 is a rear view thereof.

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