Duct and housing unit for a heat sink for electronic equipment
Lee August 26, 2
U.S. patent number D478,875 [Application Number D/159,786] was granted by the patent office on 2003-08-26 for duct and housing unit for a heat sink for electronic equipment. This patent grant is currently assigned to Zalman Tech Co., Ltd.. Invention is credited to Sang-cheol Lee.
| United States Patent | D478,875 |
| Lee | August 26, 2003 |
Duct and housing unit for a heat sink for electronic equipment
Claims
I claim the ornamental design for a duct and housing unit for a heat sink for electronic equipment, as shown and described.
| Inventors: | Lee; Sang-cheol (Kyungki-do, KR) |
|---|---|
| Assignee: | Zalman Tech Co., Ltd. (Seoul,
KR) |
| Appl. No.: | D/159,786 |
| Filed: | April 30, 2002 |
Foreign Application Priority Data
| Nov 5, 2001 [KR] | 2001-30971 | |||
| Current U.S. Class: | D13/179 |
| Current International Class: | 1303 |
| Field of Search: | ;D23/386,499,370,411 ;D14/432 ;D13/179,184 ;361/683,687-688,696-697,701-703,707 ;165/185,80.3 ;257/717 ;174/16.3 |
References Cited [Referenced By]
U.S. Patent Documents
| D262960 | February 1982 | Johnson et al. |
| 4457672 | July 1984 | Ogura et al. |
| D287120 | December 1986 | McCarthy |
| D377682 | January 1997 | Schlosser et al. |
| 5668348 | September 1997 | Lin |
| 6021045 | February 2000 | Johnson |
| 6075699 | June 2000 | Rife |
| 6219242 | April 2001 | Martinez |
| 6311766 | November 2001 | Lin et al. |
| 6386274 | May 2002 | Wang et al. |
| 6407919 | June 2002 | Chou |
Assistant Examiner: Delehanty; Robert A.
Attorney, Agent or Firm: Leydig, Voit & Mayer, Ltd.
Description
FIG. 1 is a perspective view of a duct and housing unit for a heat sink for electronic equipment according to the present invention.
FIG. 2 is a front view of a duct and housing unit for a heat sink for electronic equipment according to the present invention.
FIG. 3 is a rear view of a duct and housing unit for a heat sink for electronic equipment according to the present invention.
FIG. 4 is a right side view of a duct and housing unit for a heat sink for electronic equipment according to the present invention.
FIG. 5 is a left side view of a duct and housing unit for a heat sink for electronic equipment according to the present invention.
FIG. 6 is a top plan view of a duct and housing unit for a heat sink for electronic equipment according to the present invention.
FIG. 7 is a bottom plan view of a duct and housing unit for a heat sink for electronic equipment according to the present invention; and,
FIG. 8 is an exploded perspective view for illustrating the use of the radiator.
The broken line showing of a radiator and fan housing is for illustrative purposes only and forms no part of the claimed design.
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