U.S. patent number D478,508 [Application Number D/160,772] was granted by the patent office on 2003-08-19 for mount for packaging.
This patent grant is currently assigned to Matsushita Electric Industrial Co., Ltd.. Invention is credited to Katsuhiko Kumakura.
United States Patent |
D478,508 |
Kumakura |
August 19, 2003 |
Mount for packaging
Claims
The ornamental design for a mount for packaging, as shown and
described.
Inventors: |
Kumakura; Katsuhiko (Kyoto,
JP) |
Assignee: |
Matsushita Electric Industrial Co.,
Ltd. (Osaka, JP)
|
Appl.
No.: |
D/160,772 |
Filed: |
May 15, 2002 |
Foreign Application Priority Data
|
|
|
|
|
Nov 15, 2001 [JP] |
|
|
2001-033517 |
|
Current U.S.
Class: |
D9/451;
D9/415 |
Current International
Class: |
0907 |
Field of
Search: |
;D9/414,415,457,434
;D6/553 ;206/461-471,495,806,457,527 ;229/116.1,116.5 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Primary Examiner: Reid; Stella
Assistant Examiner: Andoll; Gregory
Attorney, Agent or Firm: Christensen O'Connor Johnson
Kindness PLLC
Description
FIG. 1 is a perspective view of the top, front and right side of a
mount for packaging showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a right side view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a reference view showing the article in an
environment.
The broken lines in the Figures are for illustrative purposes only
and form no part of the claimed design.
* * * * *