Mount for packaging

Kumakura August 19, 2

Patent Grant D478508

U.S. patent number D478,508 [Application Number D/160,772] was granted by the patent office on 2003-08-19 for mount for packaging. This patent grant is currently assigned to Matsushita Electric Industrial Co., Ltd.. Invention is credited to Katsuhiko Kumakura.


United States Patent D478,508
Kumakura August 19, 2003

Mount for packaging

Claims

The ornamental design for a mount for packaging, as shown and described.
Inventors: Kumakura; Katsuhiko (Kyoto, JP)
Assignee: Matsushita Electric Industrial Co., Ltd. (Osaka, JP)
Appl. No.: D/160,772
Filed: May 15, 2002

Foreign Application Priority Data

Nov 15, 2001 [JP] 2001-033517
Current U.S. Class: D9/451; D9/415
Current International Class: 0907
Field of Search: ;D9/414,415,457,434 ;D6/553 ;206/461-471,495,806,457,527 ;229/116.1,116.5

References Cited [Referenced By]

U.S. Patent Documents
D361935 September 1995 Johnson
D426041 May 2000 Boghossian
6070724 June 2000 McCool
D434654 December 2000 McCool
Foreign Patent Documents
1029875 Jan 1999 JP
Primary Examiner: Reid; Stella
Assistant Examiner: Andoll; Gregory
Attorney, Agent or Firm: Christensen O'Connor Johnson Kindness PLLC

Description



FIG. 1 is a perspective view of the top, front and right side of a mount for packaging showing my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a right side view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom view thereof; and,

FIG. 8 is a reference view showing the article in an environment.

The broken lines in the Figures are for illustrative purposes only and form no part of the claimed design.

* * * * *


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