Semiconductor device

Koizumi June 24, 2

Patent Grant D476296

U.S. patent number D476,296 [Application Number D/156,639] was granted by the patent office on 2003-06-24 for semiconductor device. This patent grant is currently assigned to Sharp Kabushiki Kaisha. Invention is credited to Hideshi Koizumi.


United States Patent D476,296
Koizumi June 24, 2003

Semiconductor device

Claims

The ornamental design for a "semiconductor device", as shown and described.
Inventors: Koizumi; Hideshi (Nara-ken, JP)
Assignee: Sharp Kabushiki Kaisha (Osaka, JP)
Appl. No.: D/156,639
Filed: March 6, 2002

Foreign Application Priority Data

Sep 6, 2001 [JP] 2001-026198
Sep 6, 2001 [JP] 2001-026199
Sep 6, 2001 [JP] 2001-026205
Current U.S. Class: D13/182
Current International Class: 1303
Field of Search: ;D13/182 ;257/670,672,676,686,688,690-696,703,787 ;361/736,742,748,752,760,761,774,783,784,785,798,813,820 ;372/43

References Cited [Referenced By]

U.S. Patent Documents
D278049 March 1985 Takahashi et al.
D280812 October 1985 Takahashi
5485479 January 1996 Kitamura
5604372 February 1997 Yamaguchi
5748658 May 1998 Nakanishi et al.
6034424 March 2000 Fujimura et al.
Primary Examiner: Shooman; Ted
Assistant Examiner: Sikder; Selina
Attorney, Agent or Firm: Nixon & Vanderhye

Description



FIG. 1 is a top, front and right side perspective view of a semiconductor device according to my design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a right side elevational view thereof, the left side elevational view being a mirror image thereof;

FIG. 7 is a view of a further embodiment of a semiconductor device similar to FIG. 1, the broken lines illustrating environmental structure of this embodiment which does not form part of the design of this embodiment;

FIG. 8 is a front elevational view thereof;

FIG. 9 is a rear elevational view thereof;

FIG. 10 is a top plan view thereof;

FIG. 11 is a bottom plan view thereof; and,

FIG. 12 is a right side elevational view thereof, the left side elevational view being a mirror image thereof.

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