Package for absorbent articles

Ling , et al. May 20, 2

Patent Grant D474680

U.S. patent number D474,680 [Application Number D/140,508] was granted by the patent office on 2003-05-20 for package for absorbent articles. This patent grant is currently assigned to Kimberly-Clark Worldwide, Inc.. Invention is credited to Dawn M. Huffman, Alison B. Kolterjohn, Dennis P. Laska, Lu Ling, James D. McManus, Ann M. Nichols, Paul M. Simons, Brian G. Twitchell, Hao Xueen.


United States Patent D474,680
Ling ,   et al. May 20, 2003

Package for absorbent articles

Claims

The ornamental design for a package for absorbent articles, as shown and described.
Inventors: Ling; Lu (Beijing, CN), Kolterjohn; Alison B. (Neenah, WI), Twitchell; Brian G. (Neenah, WI), Huffman; Dawn M. (Neenah, WI), McManus; James D. (Appleton, WI), Xueen; Hao (Beijing, CN), Laska; Dennis P. (Winneconne, WI), Simons; Paul M. (Appleton, WI), Nichols; Ann M. (Appleton, WI)
Assignee: Kimberly-Clark Worldwide, Inc. (Neenah, WI)
Appl. No.: D/140,508
Filed: April 19, 2001

Related U.S. Patent Documents

Application Number Filing Date Patent Number Issue Date
132753 Nov 15, 2000

Current U.S. Class: D9/705
Current International Class: 0905
Field of Search: ;D5/32 ;D9/302,305,337 ;D28/4-6,8.1,8.2 ;206/204 ;383/94,102-103,106,906 ;428/35,121,131,35.4,35.5,35.7

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Primary Examiner: Bondade; Nanda
Attorney, Agent or Firm: Senniger, Powers, Leavitt & Roedel

Description



FIG. 1 is a perspective of a package for absorbent articles of a first embodiment of the present invention;

FIG. 2 is a front elevation of the package of the first embodiment;

FIG. 3 is a rear elevation of the package of the first embodiment;

FIG. 4 is a left side elevation of the package of the first embodiment;

FIG. 5 is a right side elevation of the package of the first embodiment;

FIG. 6 is a top plan of the package of the first embodiment;

FIG. 7 is a bottom plan of the package of the first embodiment;

FIG. 8 is a front elevation of the package of the first embodiment shown with a flap in an open position;

FIG. 9 is a perspective view of a package of a second embodiment of FIG. 1;

FIG. 10 is a front elevation of the package of the second embodiment;

FIG. 11 is a rear elevation of the package of the second embodiment;

FIG. 12 is a left side elevation of the package of the second embodiment;

FIG. 13 is a right side elevation of the package of the second embodiment;

FIG. 14 is a top plan of the package of the second embodiment;

FIG. 15 is a bottom plan of the package of the second embodiment;

FIG. 16 is a front elevation of the package of the second embodiment shown with a flap in an open position;

FIG. 17 is a perspective view of a package of a third embodiment of FIG. 1;

FIG. 18 is a front elevation of the package of the third embodiment;

FIG. 19 is a rear elevation of the package of the third embodiment;

FIG. 20 is a left side elevation of the package of the third embodiment;

FIG. 21 is a right side elevation of the package of the third embodiment;

FIG. 22 is a top plan of the package of the third embodiment;

FIG. 23 is a bottom plan of the package of the third embodiment;

FIG. 24 is a front elevation of the package of the third embodiment shown with a flap in an open position;

FIG. 25 is a perspective view of a package of a fourth embodiment of FIG. 1, which is identical to the package of the third embodiment, but includes a pattern printed thereon;

FIG. 26 is a perspective view of a package of a fifth embodiment of FIG. 1;

FIG. 27 is a front elevation of the package of the fifth embodiment;

FIG. 28 is a rear elevation of the package of the fifth embodiment;

FIG. 29 is a left side elevation of the package of the fifth embodiment;

FIG. 30 is a right side elevation of the package of the fifth embodiment;

FIG. 31 is a top plan of the package of the fifth embodiment;

FIG. 32 is a bottom plan of the package of the fifth embodiment;

FIG. 33 is a front elevation of the package of the fifth embodiment shown with a flap in an open position;

FIG. 34 is a perspective view of a package of a sixth embodiment of FIG. 1, which is identical to the package of the fifth embodiment, but includes a pattern printed thereon;

FIG. 35 is a perspective view of a package of a seventh embodiment of FIG. 1;

FIG. 36 is a front elevation of the package of the seventh embodiment;

FIG. 37 is a rear elevation of the package of the seventh embodiment;

FIG. 38 is a left side elevation of the package of the seventh embodiment;

FIG. 39 is a right side elevation of the package of the seventh embodiment;

FIG. 40 is a top plan of the package of the seventh embodiment;

FIG. 41 is a bottom plan of the package of the seventh embodiment;

FIG. 42 is a front elevation of the package of the seventh embodiment shown with a flap in an open position;

FIG. 43 is a perspective view of a package of a eighth embodiment of FIG. 1, which is identical to the package of the seventh embodiment, but includes a pattern printed thereon;

FIG. 44 is a perspective view of a package of a ninth embodiment of FIG. 1;

FIG. 45 is a front elevation of the package of the ninth embodiment;

FIG. 46 is a rear elevation of the package of the ninth embodiment;

FIG. 47 is a left side elevation of the package of the ninth embodiment;

FIG. 48 is a right side elevation of the package of the ninth embodiment;

FIG. 49 is a top plan of the package of the ninth embodiment;

FIG. 50 is a bottom plan of the package of the ninth embodiment;

FIG. 51 is a front elevation of the package of the ninth embodiment shown with a flap in an open position;

FIG. 52 is a perspective view of a package of a tenth embodiment of FIG. 1, which is identical to the package of the ninth embodiment, but includes a pattern printed thereon;

FIG. 53 is a perspective view of a package of a eleventh embodiment of FIG. 1;

FIG. 54 is a front elevation of the package of the eleventh embodiment;

FIG. 55 is a rear elevation of the package of the eleventh embodiment;

FIG. 56 is a left side elevation of the package of the eleventh embodiment;

FIG. 57 is a right side elevation of the package of the eleventh embodiment;

FIG. 58 is a top plan of the package of the eleventh embodiment;

FIG. 59 is a bottom plan of the package of the eleventh embodiment;

FIG. 60 is a front elevation of the package of the eleventh embodiment shown with a flap in an open position; and,

FIG. 61 is a perspective view of a package of a twelfth embodiment of FIG. 1, which is identical to the package of the eleventh embodiment, but includes a pattern printed thereon.

The broken line shown is for illustrative purposes only and forms no part of the claimed design.

The features shown in phantom form no part of the design.

* * * * *


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