U.S. patent number D474,680 [Application Number D/140,508] was granted by the patent office on 2003-05-20 for package for absorbent articles.
This patent grant is currently assigned to Kimberly-Clark Worldwide, Inc.. Invention is credited to Dawn M. Huffman, Alison B. Kolterjohn, Dennis P. Laska, Lu Ling, James D. McManus, Ann M. Nichols, Paul M. Simons, Brian G. Twitchell, Hao Xueen.
United States Patent |
D474,680 |
Ling , et al. |
May 20, 2003 |
Package for absorbent articles
Claims
The ornamental design for a package for absorbent articles, as
shown and described.
Inventors: |
Ling; Lu (Beijing,
CN), Kolterjohn; Alison B. (Neenah, WI),
Twitchell; Brian G. (Neenah, WI), Huffman; Dawn M.
(Neenah, WI), McManus; James D. (Appleton, WI), Xueen;
Hao (Beijing, CN), Laska; Dennis P. (Winneconne,
WI), Simons; Paul M. (Appleton, WI), Nichols; Ann M.
(Appleton, WI) |
Assignee: |
Kimberly-Clark Worldwide, Inc.
(Neenah, WI)
|
Appl.
No.: |
D/140,508 |
Filed: |
April 19, 2001 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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132753 |
Nov 15, 2000 |
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Current U.S.
Class: |
D9/705 |
Current International
Class: |
0905 |
Field of
Search: |
;D5/32 ;D9/302,305,337
;D28/4-6,8.1,8.2 ;206/204 ;383/94,102-103,106,906
;428/35,121,131,35.4,35.5,35.7 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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2109782 |
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May 1995 |
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CA |
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39 23 289 |
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Oct 1990 |
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DE |
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83 19 608.0 |
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Dec 1984 |
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GB |
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WO 98/57610 |
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Dec 1998 |
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WO |
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WO 02/08087 |
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Jan 2002 |
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WO |
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Primary Examiner: Bondade; Nanda
Attorney, Agent or Firm: Senniger, Powers, Leavitt &
Roedel
Description
FIG. 1 is a perspective of a package for absorbent articles of a
first embodiment of the present invention;
FIG. 2 is a front elevation of the package of the first
embodiment;
FIG. 3 is a rear elevation of the package of the first
embodiment;
FIG. 4 is a left side elevation of the package of the first
embodiment;
FIG. 5 is a right side elevation of the package of the first
embodiment;
FIG. 6 is a top plan of the package of the first embodiment;
FIG. 7 is a bottom plan of the package of the first embodiment;
FIG. 8 is a front elevation of the package of the first embodiment
shown with a flap in an open position;
FIG. 9 is a perspective view of a package of a second embodiment of
FIG. 1;
FIG. 10 is a front elevation of the package of the second
embodiment;
FIG. 11 is a rear elevation of the package of the second
embodiment;
FIG. 12 is a left side elevation of the package of the second
embodiment;
FIG. 13 is a right side elevation of the package of the second
embodiment;
FIG. 14 is a top plan of the package of the second embodiment;
FIG. 15 is a bottom plan of the package of the second
embodiment;
FIG. 16 is a front elevation of the package of the second
embodiment shown with a flap in an open position;
FIG. 17 is a perspective view of a package of a third embodiment of
FIG. 1;
FIG. 18 is a front elevation of the package of the third
embodiment;
FIG. 19 is a rear elevation of the package of the third
embodiment;
FIG. 20 is a left side elevation of the package of the third
embodiment;
FIG. 21 is a right side elevation of the package of the third
embodiment;
FIG. 22 is a top plan of the package of the third embodiment;
FIG. 23 is a bottom plan of the package of the third
embodiment;
FIG. 24 is a front elevation of the package of the third embodiment
shown with a flap in an open position;
FIG. 25 is a perspective view of a package of a fourth embodiment
of FIG. 1, which is identical to the package of the third
embodiment, but includes a pattern printed thereon;
FIG. 26 is a perspective view of a package of a fifth embodiment of
FIG. 1;
FIG. 27 is a front elevation of the package of the fifth
embodiment;
FIG. 28 is a rear elevation of the package of the fifth
embodiment;
FIG. 29 is a left side elevation of the package of the fifth
embodiment;
FIG. 30 is a right side elevation of the package of the fifth
embodiment;
FIG. 31 is a top plan of the package of the fifth embodiment;
FIG. 32 is a bottom plan of the package of the fifth
embodiment;
FIG. 33 is a front elevation of the package of the fifth embodiment
shown with a flap in an open position;
FIG. 34 is a perspective view of a package of a sixth embodiment of
FIG. 1, which is identical to the package of the fifth embodiment,
but includes a pattern printed thereon;
FIG. 35 is a perspective view of a package of a seventh embodiment
of FIG. 1;
FIG. 36 is a front elevation of the package of the seventh
embodiment;
FIG. 37 is a rear elevation of the package of the seventh
embodiment;
FIG. 38 is a left side elevation of the package of the seventh
embodiment;
FIG. 39 is a right side elevation of the package of the seventh
embodiment;
FIG. 40 is a top plan of the package of the seventh embodiment;
FIG. 41 is a bottom plan of the package of the seventh
embodiment;
FIG. 42 is a front elevation of the package of the seventh
embodiment shown with a flap in an open position;
FIG. 43 is a perspective view of a package of a eighth embodiment
of FIG. 1, which is identical to the package of the seventh
embodiment, but includes a pattern printed thereon;
FIG. 44 is a perspective view of a package of a ninth embodiment of
FIG. 1;
FIG. 45 is a front elevation of the package of the ninth
embodiment;
FIG. 46 is a rear elevation of the package of the ninth
embodiment;
FIG. 47 is a left side elevation of the package of the ninth
embodiment;
FIG. 48 is a right side elevation of the package of the ninth
embodiment;
FIG. 49 is a top plan of the package of the ninth embodiment;
FIG. 50 is a bottom plan of the package of the ninth
embodiment;
FIG. 51 is a front elevation of the package of the ninth embodiment
shown with a flap in an open position;
FIG. 52 is a perspective view of a package of a tenth embodiment of
FIG. 1, which is identical to the package of the ninth embodiment,
but includes a pattern printed thereon;
FIG. 53 is a perspective view of a package of a eleventh embodiment
of FIG. 1;
FIG. 54 is a front elevation of the package of the eleventh
embodiment;
FIG. 55 is a rear elevation of the package of the eleventh
embodiment;
FIG. 56 is a left side elevation of the package of the eleventh
embodiment;
FIG. 57 is a right side elevation of the package of the eleventh
embodiment;
FIG. 58 is a top plan of the package of the eleventh
embodiment;
FIG. 59 is a bottom plan of the package of the eleventh
embodiment;
FIG. 60 is a front elevation of the package of the eleventh
embodiment shown with a flap in an open position; and,
FIG. 61 is a perspective view of a package of a twelfth embodiment
of FIG. 1, which is identical to the package of the eleventh
embodiment, but includes a pattern printed thereon.
The broken line shown is for illustrative purposes only and forms
no part of the claimed design.
The features shown in phantom form no part of the design.
* * * * *