Earphone headset

Description

FIG. 1 is a perspective view of an earphone headset of the design as seen from the front and one side with the boom and the connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 2 is a front elevation view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 3 is a rear elevation view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 4 is a side elevation view as seen from left to right of the view shown in FIG. 2 with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 5 is a side elevation view as seen from right to left of the view shown in FIG. 2 with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 6 is a top plan view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 7 is a bottom plan view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 8 is a perspective view of a modified embodiment of the earphone headset of the design as seen from the front and one side with boom and the connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 9 is a front elevation view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 10 is a rear elevation view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 11 is a side elevation view as seen from left to right of the view shown in FIG. 2 with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 12 is a side elevation view as seen from right to left of the view shown in FIG. 2 with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 13 is a top plan view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention; and,

FIG. 14 is a bottom plan view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention.

Claims

We claim the ornamental design for an earphone headset, as shown and described.

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Inventors:	Pham; Hoa (Woodbury, MN), Lardy; Jason (Minneapolis, MN)
Assignee:	Telex Communications, Inc. (Burnsville, MN)
Appl. No.:	D/154,626
Filed:	January 24, 2002

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Current U.S. Class:	D14/205
Current International Class:	1401
Field of Search:	;D14/205,206,142,192,223 ;181/129,130,135 ;379/430,431 ;381/151,183,187

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References Cited [Referenced By]

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U.S. Patent Documents

5117464	May 1992	Jones et al.
5359157	October 1994	Liu
D358391	May 1995	Isono
D366486	January 1996	Runquist et al.
D375313	November 1996	Jensen et al.
D394437	May 1998	Landreth et al.
5793865	August 1998	Leifer
5793878	August 1998	Chang
D404734	January 1999	Andrea
D423012	April 2000	Yasutomi
D443870	June 2001	Carpenter et al.
D448751	October 2001	Pham et al.
D449038	October 2001	Andreini et al.
D449289	October 2001	Weikel et al.
D458246	June 2002	Davies et al.
D458248	June 2002	Davies et al.

Primary Examiner: Mortimer; Paula A.
Attorney, Agent or Firm: Fredrikson & Byron, P.A.