Shrink wrapped carton for electronic component

Leja September 3, 2

Patent Grant D462262

U.S. patent number D462,262 [Application Number D/133,052] was granted by the patent office on 2002-09-03 for shrink wrapped carton for electronic component. This patent grant is currently assigned to Koninklijke Philips Electronics, N.V.. Invention is credited to David P. Leja.


United States Patent D462,262
Leja September 3, 2002

Shrink wrapped carton for electronic component

Claims

The ornamental design for a shrink wrapped carton for electronic component, as shown.
Inventors: Leja; David P. (Dodgeville, WI)
Assignee: Koninklijke Philips Electronics, N.V. (Eindhoven, NL)
Appl. No.: D/133,052
Filed: November 21, 2000

Current U.S. Class: D9/415
Current International Class: 0903
Field of Search: ;D9/414,415,418,432,337 ;D3/201,273,905 ;206/461-471,806,495,701,722,723,349

References Cited [Referenced By]

U.S. Patent Documents
4355758 October 1982 Lavery
4450959 May 1984 Sommer
4605007 August 1986 Heraly
5184725 February 1993 Reinheimer et al.
D420906 February 2000 Nash et al.
D425415 May 2000 Kumakura et al.
D434648 December 2000 Li et al.
Primary Examiner: Deshmukh; Prabhakar
Attorney, Agent or Firm: Kraus; Robert J.

Description



FIG. 1 is a perspective view of a shrink-wrapped package for an electronic component showing my new design.

FIG. 2 is a front view of the package shown in FIG. 1.

FIG. 3 is a rear view of the package shown in FIG. 1.

FIG. 4 is a left side view of the package shown in FIG. 1.

FIG. 5 is a right side view of the package shown in FIG. 1.

FIG. 6 is a top view of the package shown in FIG. 1; and,

FIG. 7 is a bottom view of the package shown in FIG. 1.

* * * * *


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