Saw blade
Kim , et al. July 23, 2
U.S. patent number D460,767 [Application Number D/142,073] was granted by the patent office on 2002-07-23 for saw blade. This patent grant is currently assigned to Ehwa Diamond Ind. Co.,Ltd.. Invention is credited to Jang Hyuk Ahn, See Hyung Kim.
| United States Patent | D460,767 |
| Kim , et al. | July 23, 2002 |
Saw blade
Claims
The ornamental design for a saw blade, as shown and described.
| Inventors: | Kim; See Hyung (Osan-Si, KR), Ahn; Jang Hyuk (Osan-Si, KR) |
|---|---|
| Assignee: | Ehwa Diamond Ind. Co.,Ltd.
(Kyongki-do, KR) |
| Appl. No.: | D/142,073 |
| Filed: | May 17, 2001 |
Foreign Application Priority Data
| Feb 15, 2001 [KR] | 2001-3460 | |||
| Current U.S. Class: | D15/139 |
| Current International Class: | 1509 |
| Field of Search: | ;D8/70 ;D15/139 ;83/835,855,663,666,676,349,502,508.2,675 ;125/15,18 ;451/541,299 |
References Cited [Referenced By]
U.S. Patent Documents
| 6110031 | August 2000 | Preston et al. |
| D447496 | September 2001 | Lee et al. |
Attorney, Agent or Firm: Harrison & Egbert
Description
FIG. 1 is an upper perspective view of the saw blade showing my design.
FIG. 2 is a front view thereof;
FIG. 3 is a back view thereof;
FIG. 4 is a side view thereof;
FIG. 5 is an opposite side view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a bottom view thereof.
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