Hybrid integrated circuit device

Ebihara , et al. July 2, 2

Patent Grant D459706

U.S. patent number D459,706 [Application Number D/145,538] was granted by the patent office on 2002-07-02 for hybrid integrated circuit device. This patent grant is currently assigned to Taiyo Yuden Co., Ltd.. Invention is credited to Hitoshi Ebihara, Tomohiro Igarashi, Tetsuya Ito, Hideki Kato, Naoki Tomaru, Yoshiyuki Wasada, Hideki Yoda.


United States Patent D459,706
Ebihara ,   et al. July 2, 2002

Hybrid integrated circuit device

Claims

The ornamental design for a hybrid integrated circuit device, as shown and described.
Inventors: Ebihara; Hitoshi (Tokyo, JP), Tomaru; Naoki (Tokyo, JP), Wasada; Yoshiyuki (Tokyo, JP), Ito; Tetsuya (Tokyo, JP), Kato; Hideki (Tokyo, JP), Igarashi; Tomohiro (Tokyo, JP), Yoda; Hideki (Tokyo, JP)
Assignee: Taiyo Yuden Co., Ltd. (Tokyo, JP)
Appl. No.: D/145,538
Filed: July 26, 2001

Foreign Application Priority Data

Apr 27, 2001 [JP] 2001-016231
Current U.S. Class: D13/182
Current International Class: 1303
Field of Search: ;D13/182,123,133,180,184,199 ;D10/46,75 ;29/829-932,846 ;174/250-251,253-255,260-261,268 ;216/13 ;292/314 ;316/718,748,752-753,760,783-784,820 ;411/500 ;428/901 ;470/27

References Cited [Referenced By]

U.S. Patent Documents
D357671 April 1995 Terasawa et al.
5742480 April 1998 Sawada et al.
D396450 July 1998 Nishiura et al.
5838546 November 1998 Miyoshi
5905639 May 1999 Warren
6028773 February 2000 Hundt
6201701 March 2001 Linden et al.
Primary Examiner: Shooman; Ted
Assistant Examiner: Bui; Daniel
Attorney, Agent or Firm: Bacon & Thomas

Description



FIG. 1 is a perspective view of a hybrid integrated circuit device showing an embodiment of our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

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