U.S. patent number D456,787 [Application Number D/143,470] was granted by the patent office on 2002-05-07 for hybrid integrated circuit device.
This patent grant is currently assigned to Taiyo Yuden Co., Ltd.. Invention is credited to Tetsuya Ito, Naoki Tomaru, Yoshiyuki Wasada.
United States Patent |
D456,787 |
Wasada , et al. |
May 7, 2002 |
Hybrid integrated circuit device
Claims
The ornamental design for a hybrid integrated circuit device, as
shown and described.
Inventors: |
Wasada; Yoshiyuki (Tokyo,
JP), Ito; Tetsuya (Tokyo, JP), Tomaru;
Naoki (Tokyo, JP) |
Assignee: |
Taiyo Yuden Co., Ltd. (Tokyo,
JP)
|
Appl.
No.: |
D/143,470 |
Filed: |
June 15, 2001 |
Foreign Application Priority Data
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|
|
|
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Dec 8, 2000 [JP] |
|
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2000-038080 |
Dec 8, 2000 [JP] |
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2000-038089 |
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Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/182,110,123,133,199
;D10/46,75 ;29/829-832,846 ;174/250-251,253-255,260-261,268 ;216/13
;292/314 ;361/718,748,752-753,760,783-784,820 ;411/500 ;428/901
;470/27 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Shooman; Ted
Assistant Examiner: Bui; Daniel
Attorney, Agent or Firm: Bacon & Thomas
Description
FIG. 1 is a perspective view of a hybrid integrated circuit device
showing an embodiment of our new design;
FIG. 2 is a front elevational view thereof, which is symmetrical to
a rear elevational view not shown herein;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a cross sectional view, taken along the line A--A of FIG.
5.
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