Arrangement of aluminum foil coils forming an inductor of a resonant frequency identification element

Robson December 18, 2

Patent Grant D452220

U.S. patent number D452,220 [Application Number D/136,375] was granted by the patent office on 2001-12-18 for arrangement of aluminum foil coils forming an inductor of a resonant frequency identification element. This patent grant is currently assigned to Meto International GmbH. Invention is credited to David Robson.


United States Patent D452,220
Robson December 18, 2001

Arrangement of aluminum foil coils forming an inductor of a resonant frequency identification element

Claims

The ornamental design for an arrangement of aluminum foil coils forming an inductor of a resonant frequency identification element, as shown and described.
Inventors: Robson; David (Crowborough, GB)
Assignee: Meto International GmbH (Hirschhorn, DE)
Appl. No.: D/136,375
Filed: January 31, 2001

Related U.S. Patent Documents

Application Number Filing Date Patent Number Issue Date
103482 Apr 15, 1999

Foreign Application Priority Data

Oct 15, 1998 [DE] 498 10 255
Current U.S. Class: D13/182
Current International Class: 1303
Field of Search: ;D13/182 ;336/12,20,200,212 ;340/572

References Cited [Referenced By]

U.S. Patent Documents
3967161 June 1976 Lichtblau
4498076 February 1985 Lichtblau
5969590 October 1999 Gutierrez
6087922 July 2000 Smith
6114937 September 2000 Burghartz et al.
6144281 November 2000 Lorris
6147582 November 2000 Goldsmith et al.
Foreign Patent Documents
0755036 Jan 1997 EP
Primary Examiner: Vinson; Brian N.
Attorney, Agent or Firm: Jones, Tullar & Cooper, P.C.

Description



FIG. 1 is a top view of the arrangement of aluminum foil coils forming an inductor of the resonant frequency indentification of the present invention;

FIG. 2 is a bottom view of the arrangement of FIG. 1;

FIG. 3 is a top view of the arrangement of aluminum foil coils mounted on a chip dimensioned differently from the arrangement of FIGS. 1 and 2;

FIG. 4 is a bottom view of the arrangement of FIG. 3;

FIG. 5 is a top view of another arrangement of aluminum foil coils mounted on a chip;

FIG. 6 is a bottom view of the arrangement of FIG. 5;

FIG. 7 is a top view of an arrangement of aluminum foil coils mounted on a chip dimensioned differently from the arrangement of FIGS. 1, 2, 3, 4 and 5;

FIG. 8 is a bottom view of the arrangement of FIG. 5;

FIG. 9 is a top view of another arrangment of aluminum foil coils mounted on a chip;

FIG. 10 is a bottom view of the arrangement of FIG. 9;

FIG. 11 is a top view of an arrangement of aluminum foil coils mounted on a chip dimensioned differently from the arrangement of FIGS. 9 and 10; and,

FIG. 12 is a bottom view of the arrangement of FIG. 11.

The arrangement of coils is of nominal thickness.

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