U.S. patent number D452,220 [Application Number D/136,375] was granted by the patent office on 2001-12-18 for arrangement of aluminum foil coils forming an inductor of a resonant frequency identification element.
This patent grant is currently assigned to Meto International GmbH. Invention is credited to David Robson.
United States Patent |
D452,220 |
Robson |
December 18, 2001 |
Arrangement of aluminum foil coils forming an inductor of a
resonant frequency identification element
Claims
The ornamental design for an arrangement of aluminum foil coils
forming an inductor of a resonant frequency identification element,
as shown and described.
Inventors: |
Robson; David (Crowborough,
GB) |
Assignee: |
Meto International GmbH
(Hirschhorn, DE)
|
Appl.
No.: |
D/136,375 |
Filed: |
January 31, 2001 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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103482 |
Apr 15, 1999 |
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Foreign Application Priority Data
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Oct 15, 1998 [DE] |
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498 10 255 |
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Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/182
;336/12,20,200,212 ;340/572 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Primary Examiner: Vinson; Brian N.
Attorney, Agent or Firm: Jones, Tullar & Cooper,
P.C.
Description
FIG. 1 is a top view of the arrangement of aluminum foil coils
forming an inductor of the resonant frequency indentification of
the present invention;
FIG. 2 is a bottom view of the arrangement of FIG. 1;
FIG. 3 is a top view of the arrangement of aluminum foil coils
mounted on a chip dimensioned differently from the arrangement of
FIGS. 1 and 2;
FIG. 4 is a bottom view of the arrangement of FIG. 3;
FIG. 5 is a top view of another arrangement of aluminum foil coils
mounted on a chip;
FIG. 6 is a bottom view of the arrangement of FIG. 5;
FIG. 7 is a top view of an arrangement of aluminum foil coils
mounted on a chip dimensioned differently from the arrangement of
FIGS. 1, 2, 3, 4 and 5;
FIG. 8 is a bottom view of the arrangement of FIG. 5;
FIG. 9 is a top view of another arrangment of aluminum foil coils
mounted on a chip;
FIG. 10 is a bottom view of the arrangement of FIG. 9;
FIG. 11 is a top view of an arrangement of aluminum foil coils
mounted on a chip dimensioned differently from the arrangement of
FIGS. 9 and 10; and,
FIG. 12 is a bottom view of the arrangement of FIG. 11.
The arrangement of coils is of nominal thickness.
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