Mold produced housing for enclosing the connection between a cable and a connector
Milan December 11, 2
U.S. patent number D451,888 [Application Number D/132,536] was granted by the patent office on 2001-12-11 for mold produced housing for enclosing the connection between a cable and a connector. Invention is credited to Henry Milan.
| United States Patent | D451,888 |
| Milan | December 11, 2001 |
Mold produced housing for enclosing the connection between a cable and a connector
Claims
The ornamental design for a mold produced housing for enclosing the connection between a cable and a connector, as shown and described.
| Inventors: | Milan; Henry (Rochester Hills, MI) |
|---|---|
| Appl. No.: | D/132,536 |
| Filed: | November 10, 2000 |
| Current U.S. Class: | D13/154; D13/147 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/133,146,147,154,156 ;439/445,483,488-490,606-610,680,344,447 |
References Cited [Referenced By]
U.S. Patent Documents
| D402266 | December 1998 | Siemon et al. |
| D429484 | August 2000 | Nishio et al. |
| 5334044 | August 1994 | Falossi et al. |
| 5620335 | April 1997 | Siemon |
Attorney, Agent or Firm: Marshall & Melhorn, LLC
Description
FIG. 1 is a front elevational view of a mold produced housing for enclosing the connection between a cable and a connector showing my new design.
FIG. 2 is a rear elevational view thereof.
FIG. 3 is a top plan view thereof.
FIG. 4 is a bottom plan view thereof.
FIG. 5 is a right side elevational view thereof; and,
FIG. 6 is a left side elevational view thereof.
The broken line environmental showing is for illustrative purposes only and forms no part of the claimed design.
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