Molded cable interconnect
Lee August 28, 2
U.S. patent number D447,120 [Application Number D/130,163] was granted by the patent office on 2001-08-28 for molded cable interconnect. This patent grant is currently assigned to Monster Cable Products, Inc.. Invention is credited to Kendrew Lee.
| United States Patent | D447,120 |
| Lee | August 28, 2001 |
| **Please see images for: ( Certificate of Correction ) ** |
Molded cable interconnect
Claims
The ornamental design for a molded cable interconnect, as shown and described.
| Inventors: | Lee; Kendrew (Fremont, CA) |
|---|---|
| Assignee: | Monster Cable Products, Inc.
(Brisbane, CA) |
| Appl. No.: | D/130,163 |
| Filed: | September 27, 2000 |
| Current U.S. Class: | D13/146; D13/153 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/133,153,146 ;439/502,606 ;174/72C,72R |
References Cited [Referenced By]
U.S. Patent Documents
| D347208 | May 1994 | Martin et al. |
| D387733 | December 1997 | Lee |
| D392942 | March 1998 | Lee |
| D429218 | August 2000 | Lee |
| 5243136 | September 1993 | Chen |
| 5322972 | June 1994 | Fitch et al. |
| 5347089 | September 1994 | Barrat et al. |
| 5726388 | March 1998 | Ferland |
| 5792986 | August 1998 | Lee |
| 5937950 | August 1999 | Adams et al. |
| 5984717 | November 1999 | Lee |
Attorney, Agent or Firm: LaRiviere, Grubman & Payne, LLP
Description
A portion of the disclosure of this design patent application document contains material to which a claim for copyright is also made. The copyright owner has no objection to the facsimile reproduction of this design patent application by anyone as it appears in the Patent and Trademark Office patent file or records, but reserves all other copyrights whatsoever.
FIG. 1 is a perspective view of a first embodiment of a molded cable interconnect, in accordance with the present invention.
FIG. 2 is a plan view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.
FIG. 3 is an underside view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.
FIG. 4 is a side view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.
FIG. 5 is a corresponding side view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1, as depicted in FIG. 1.
FIG. 6 is a rear view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.
FIG. 7 is a frontal view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.
FIG. 8 is a perspective view of a second embodiment of a molded cable interconnect, in accordance with the present invention.
FIG. 9 is a plan view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.
FIG. 10 is an underside view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.
FIG. 11 is a side view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.
FIG. 12 is a corresponding side view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.
FIG. 13 is a rear view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8; and,
FIG. 14 is a frontal view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.
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