U.S. patent number D442,556 [Application Number D/132,525] was granted by the patent office on 2001-05-22 for mold produced housing for enclosing the connection between a cable and a connector. Invention is credited to Henry Milan.
United States Patent | D442,556 |
Milan | May 22, 2001 |
Inventors: | Milan; Henry (Rochester Hills, MI) |
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Appl. No.: | D/132,525 |
Filed: | November 10, 2000 |
Current U.S. Class: | D13/154; D13/147 |
Current International Class: | 1303 |
Field of Search: | ;D13/133,146,147,154,156 ;439/358,362,372,588,607-610,687,696,731 |
D379968 | June 1997 | Tan et al. |
D396689 | August 1998 | Karten et al. |
D416230 | November 1999 | Narumo et al. |
5041011 | August 1991 | Chiang |
5569047 | October 1996 | Pauza et al. |
5749746 | May 1998 | Tan et al. |
5941726 | August 1999 | Koegel et al. |
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