Mold produced housing for enclosing the connection between a cable and a connector

Milan May 22, 2

Patent Grant D442556

U.S. patent number D442,556 [Application Number D/132,525] was granted by the patent office on 2001-05-22 for mold produced housing for enclosing the connection between a cable and a connector. Invention is credited to Henry Milan.


United States Patent D442,556
Milan May 22, 2001

Mold produced housing for enclosing the connection between a cable and a connector

Claims

The ornamental design for a mold produced housing for enclosing the connection between a cable and a connector, as shown and described.
Inventors: Milan; Henry (Rochester Hills, MI)
Appl. No.: D/132,525
Filed: November 10, 2000

Current U.S. Class: D13/154; D13/147
Current International Class: 1303
Field of Search: ;D13/133,146,147,154,156 ;439/358,362,372,588,607-610,687,696,731

References Cited [Referenced By]

U.S. Patent Documents
D379968 June 1997 Tan et al.
D396689 August 1998 Karten et al.
D416230 November 1999 Narumo et al.
5041011 August 1991 Chiang
5569047 October 1996 Pauza et al.
5749746 May 1998 Tan et al.
5941726 August 1999 Koegel et al.
Primary Examiner: Sincavage; Joel
Attorney, Agent or Firm: Marshall & Melhorn, LLC

Description



FIG. 1 is a front elevational view of a mold produced housing for enclosing the connection between a cable and a connector showing my new design.

FIG. 2 is a rear elevational view thereof.

FIG. 3 is a top plan view thereof.

FIG. 4 is a bottom plan view thereof.

FIG. 5 is a right side elevational view thereof; and,

FIG. 6 is a left side elevational view thereof.

The broken lines in FIG. 1 are included for the purpose of illustrating environmental structure only and form no part of the claimed design.

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