IC module

Description

FIG. 1 is a perspective view of the front, bottom and right side of an IC module showing my new design;

FIG. 2 is a perspective view of the rear, bottom and left side thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a front elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a rear elevational view thereof; and,

FIG. 8 is a left side elevational view thereof.

Claims

The ornamental design for an IC module, as shown and described.

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Inventors:	Shinada; Satoshi (Nagano, JP)
Assignee:	Seiko Epson Corporation (Tokyo, JP)
Appl. No.:	D/111,928
Filed:	October 6, 1999

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Foreign Application Priority Data

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Apr 6, 1999 [JP]			11-8901

Current U.S. Class:	D14/436
Current International Class:	1402
Field of Search:	;D14/432,435-438 ;361/686,728,737,736 ;D13/182 ;D19/9-10

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References Cited [Referenced By]

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U.S. Patent Documents

D369157	April 1996	Ohmori et al.
D370904	June 1996	Nakata et al.
D374870	October 1996	Gaumet
D386903	April 1996	Ohmori et al.
D387746	December 1997	Ishihara
D389130	January 1998	Ishihara
5576935	November 1996	Freer et al.
5982624	November 1999	Onoda et al.

Primary Examiner: Tung; M. H.
Attorney, Agent or Firm: Stroock & Stroock & Lavan LLP