Crimp terminal Patent Grant Kawamoto November 28, 2 [Japan Solderless Terminal Mfg. Co., Ltd]

Crimp terminal

Kawamoto November 28, 2

Patent Grant D434375

U.S. patent number D434,375 [Application Number D/109,948] was granted by the patent office on 2000-11-28 for crimp terminal. This patent grant is currently assigned to Japan Solderless Terminal Mfg. Co., Ltd. Invention is credited to Hideo Kawamoto.

United States Patent	D434,375
Kawamoto	November 28, 2000

Crimp terminal

Claims

I claim the ornamental design for a crimp terminal, as shown and described.

Inventors:	Kawamoto; Hideo (Kanagawa, JP)
Assignee:	Japan Solderless Terminal Mfg. Co., Ltd (JP)
Appl. No.:	D/109,948
Filed:	August 25, 1999

Foreign Application Priority Data


Mar 9, 1999 [JP]			11-6010

Current U.S. Class:	D13/133; D13/149
Current International Class:	1303
Field of Search:	;D13/133,149 ;439/839,852,862

References Cited [Referenced By]

U.S. Patent Documents


D241650	September 1976	Pauza et al.
2744244	May 1956	Schumacher et al.
4220388	September 1980	Dechelette
4306761	December 1981	Ress, Jr.
4566747	January 1986	Peers
5281178	January 1994	Biscorner

Primary Examiner: Sincavage; Joel
Attorney, Agent or Firm: Rader, Fishman & Grauer

Description

FIG. 1 is a top plan view of a crimp terminal;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a sectional view taken on line 4--4 of FIG. 1;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof; and,

FIG. 7 is a perspective view thereof.

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