Hinge unit for vacuum-processing a semiconductor wafer

Description

FIG. 1 is a front elevational view of hinge unit for vacuum-processing a semiconductor wafer, showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a rear elevational view thereof; and,

FIG. 6 is a left side elevational view thereof.

Claims

The ornamental design for a hinge unit for vacuum-processing a semiconductor wafer, as shown.

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Inventors:	Mizukami; Masami (Kofu, JP)
Assignee:	Tokyo Electron Limited (Tokyo, JP)
Appl. No.:	D/086,850
Filed:	April 21, 1998

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Foreign Application Priority Data

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Oct 21, 1997 [JP]			9-72009

Current U.S. Class:	D15/122; D15/138; D15/141; D8/323
Current International Class:	1509
Field of Search:	;D13/182 ;414/217,935,937 ;16/221,244,354 ;49/149,152,153,246,247,254 ;D15/122,138,141 ;D8/323

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References Cited [Referenced By]

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U.S. Patent Documents

D139795	December 1944	Terry
1120163	December 1914	Sanders
4011628	March 1977	Bengtsson
4923054	May 1990	Ohtani et al.
5195210	March 1993	Lee

Primary Examiner: Douglas; Alan P.
Assistant Examiner: Tabor; Lavone D.
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.