Case for headphones

Description

FIG. 1 is a perspective view of a first embodiment of a case for headphones showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a right side elevational view thereof; and

FIG. 7 is a rear elevational view thereof.

FIG. 8 is a perspective view of a second embodiment of a case for headphones showing my new design;

FIG. 9 is a top plan view thereof;

FIG. 10 is a left side elevational view thereof;

FIG. 11 is a front elevational view thereof;

FIG. 12 is a bottom plan view thereof;

FIG. 13 is a right side elevational view thereof; and,

FIG. 14 is a rear elevational view thereof.

Claims

The ornamental design for a case for headphones, as shown and described.

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Inventors:	Hata; Masayuki (Tokyo, JP)
Assignee:	Sony Corporation (Tokyo, JP)
Appl. No.:	D/089,991
Filed:	June 25, 1998

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Foreign Application Priority Data

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Dec 25, 1997 [JP]			9-79824

Current U.S. Class:	D9/415; D9/418
Current International Class:	0907
Field of Search:	;D9/415,418,414,337,341,346 ;206/461-471,495,769,770,8,316.3,316.1,320,775,776,806

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References Cited [Referenced By]

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U.S. Patent Documents

D307554	May 1990	McAlister, Sr.
D332398	January 1993	Lee et al.
D344019	February 1994	Pratt
D396632	August 1998	Lee
D397865	September 1998	Lin
D406753	March 1999	Lee
4249658	February 1981	Ogura
4583641	April 1986	Gelzer
4669610	June 1987	Lindsey et al.

Other References

Modern Packaging Cat. p. 300, 1941. . Techform Inc., Nov. 1982. . Catalog "Value Up", Sony, MDR-E868LP, MDR-E868SP, MDR-E868MP1, p. 7, (Feb. 1998)..

Primary Examiner: Deshmukh; Prabhakar
Attorney, Agent or Firm: Foley & Lardner