Silicon glue injector

Hwang August 31, 1

Patent Grant D413235

U.S. patent number D413,235 [Application Number D/090,628] was granted by the patent office on 1999-08-31 for silicon glue injector. This patent grant is currently assigned to Kai Shyun Enterprise Co, Ltd.. Invention is credited to Chi-Chuan Hwang.


United States Patent D413,235
Hwang August 31, 1999

Silicon glue injector

Claims

The ornamental design for "silicon glue injector," as shown and described.
Inventors: Hwang; Chi-Chuan (Changhua Hsien, TW)
Assignee: Kai Shyun Enterprise Co, Ltd. (Changhua Hsien, TW)
Appl. No.: D/090,628
Filed: July 13, 1998

Current U.S. Class: D8/14.1
Current International Class: 0805
Field of Search: ;D8/14.1 ;222/309,321.1-321.9,323,325,326,327,391,386

References Cited [Referenced By]

U.S. Patent Documents
D170428 September 1953 Peterson
D285895 September 1986 Cox
D349438 August 1994 Owens
D369285 April 1996 Leech
D388672 January 1998 Kelders et al.
Primary Examiner: Wallace; Terry A.
Attorney, Agent or Firm: Bacon & Thomas, PLLC

Description



FIG. 1 is a perspective view of silicon glue injector showing my new design.

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof, the right side is identical;

FIG. 5 is top view thereof; and,

FIG. 6 is a bottom view thereof.

* * * * *


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