Headphone

Description

FIG. 1 is a perspective view of a first embodiment of a headphone showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a rear elevational view thereof;

FIG. 8 is a perspective view of a second embodiment of a headphone showing my new design;

FIG. 9 is a top plan view thereof;

FIG. 10 is a left side elevational view thereof;

FIG. 11 is a front elevational view thereof;

FIG. 12 is a bottom plan view thereof;

FIG. 13 is a right side elevational view thereof; and,

FIG. 14 is a rear elevational view thereof.

Claims

The ornamental design for a headphone, as shown and described.

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Inventors:	Nakamura; Mitsuhiro (Tokyo, JP)
Assignee:	Sony Corporation (Tokyo, JP)
Appl. No.:	D/083,577
Filed:	February 12, 1998

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Foreign Application Priority Data

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Aug 13, 1997 [JP]			9-64551

Current U.S. Class:	D14/205
Current International Class:	1401
Field of Search:	;D14/137,142,147,192,205,206,223,249 ;181/129,130 ;379/430,431,433 ;381/25,68,158,183,187

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References Cited [Referenced By]

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U.S. Patent Documents

D358390	May 1995	Hayashi
D359049	June 1995	Kanno
D381987	August 1997	Tsuge
5406037	April 1995	Nageno

Primary Examiner: Hyder; Philip S.
Assistant Examiner: Bondade; Nanda
Attorney, Agent or Firm: Foley & Lardner