High density electrical connector Patent Grant Lai , et al. April 6, 1 [Hon Hai Precision Ind. Co., Ltd.]

High density electrical connector

Lai , et al. April 6, 1

Patent Grant D407690

U.S. patent number D407,690 [Application Number D/079,654] was granted by the patent office on 1999-04-06 for high density electrical connector. This patent grant is currently assigned to Hon Hai Precision Ind. Co., Ltd.. Invention is credited to Chin-Yi Lai, Kun-Tsan Wu.

United States Patent	D407,690
Lai , et al.	April 6, 1999

High density electrical connector

Claims

The ornamental design for a high density electrical connector, as shown.

Inventors:	Lai; Chin-Yi (Tu-Chen, TW), Wu; Kun-Tsan (Tu-Chen, TW)
Assignee:	Hon Hai Precision Ind. Co., Ltd. (Taipei Hsien, TW)
Appl. No.:	D/079,654
Filed:	November 21, 1997

Foreign Application Priority Data


May 30, 1997 [TW]			86304705

Current U.S. Class:	D13/147
Current International Class:	1303
Field of Search:	;D13/146,147 ;439/79-83,95,101,108,181,607-610,620

References Cited [Referenced By]

U.S. Patent Documents


D313007	December 1990	Nakamura
5066240	November 1991	Verdun
5104326	April 1992	Smith et al.
5547398	August 1996	Ichikawa et al.

Primary Examiner: Douglas; Alan P.
Assistant Examiner: Tabor; Lavone D.

Description

FIG. 1 is a perspective view of a high density electrical connector showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

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