Wafer boat for use in a semiconductor wafer heat processing apparatus

Description

FIG. 1 a perspective view of a wafer boat for use in a semiconductor wafer heat processing apparatus;

FIG. 2 a front elevational view thereof;

FIG. 3 a cross-sectional view taken along line III--III in FIG. 2;

FIG. 4 a cross-sectional view taken along line IV--IV in FIG. 2;

FIG. 5 a top plan view thereof;

FIG. 6 a right side view thereof;

FIG. 7 a rear elevational view thereof; and,

FIG. 8 a bottom plan view thereof.

Claims

I claim the ornamental design for wafer boat for use in a semiconductor wafer heat processing apparatus, as shown and described.

---

Inventors:	Shimazu; Tomohisa (Shiroyama-machi, JP)
Assignee:	Tokyo Electron Limited (Tokyo-to, JP)
Appl. No.:	D/083,425
Filed:	February 5, 1998

---

Foreign Application Priority Data

---

Aug 20, 1997 [JP]			9-65099

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;D15/140 ;206/832 ;432/152

---

References Cited [Referenced By]

---

U.S. Patent Documents

D291413	August 1987	Uehara et al.
D361752	August 1995	Yamaga
D378823	April 1997	Watanabe et al.
4743156	May 1988	Raffay et al.
4857689	August 1989	Lee
5174045	December 1992	Thompson et al.
5314574	May 1994	Takahashi
5320218	June 1994	Yamashita et al.

Primary Examiner: Vinson; Brian N.
Attorney, Agent or Firm: Ladas & Parry