Housing for electronic components

Description

FIG. 1 is a perspective front elevation view of a housing for electronic components;

FIG. 2 is a top view thereof;

FIG. 3 is a bottom view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a right side view thereof; and,

FIG. 7 is a left side view thereof.

Claims

The ornamental design for a housing for electronic components, as shown and described.

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Inventors:	Tucker; Russell L. (Sebastopol, CA), McCall; Mark S. (Santa Rosa, CA), Lovina; Bernabe R. (Benecia, CA)
Assignee:	Next Level Communications (Rohnert Park, CA)
Appl. No.:	D/071,581
Filed:	May 30, 1997

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Current U.S. Class:	D13/184
Current International Class:	1399
Field of Search:	;D13/184 ;385/134,135,147 ;361/736,801 ;439/76.1,676 ;379/419,420,428,440,441,442,399,418

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References Cited [Referenced By]

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U.S. Patent Documents

D330888	November 1992	Worley
D350533	September 1994	Grosskurth et al.
D353800	December 1994	Lewis et al.
D368068	March 1996	Alden et al.
D389840	January 1998	Tucker et al.
D391623	February 1998	Tucker et al.
4812004	March 1989	Biederstedt et al.
5285515	February 1994	Milanowski et al.
5432682	July 1995	Giehl
5546282	August 1996	Hill et al.

Primary Examiner: Vinson; Brian N.
Attorney, Agent or Firm: Skjerven, Morrill, MacPherson, Franklin & Friel LLP Heid; David W.