U.S. patent number D402,965 [Application Number D/080,625] was granted by the patent office on 1998-12-22 for modular housing for electrical circuits.
This patent grant is currently assigned to Pilz GmbH & Co.. Invention is credited to Werner Bender.
United States Patent |
D402,965 |
Bender |
December 22, 1998 |
**Please see images for:
( Certificate of Correction ) ** |
Modular housing for electrical circuits
Claims
The ornamental design for a modular housing for electrical
circuits, as shown and described.
Inventors: |
Bender; Werner (Ostfildern,
DE) |
Assignee: |
Pilz GmbH & Co.
(Ostfildern, DE)
|
Appl.
No.: |
D/080,625 |
Filed: |
December 11, 1997 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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44162 |
Sep 19, 1995 |
Des. 394642 |
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Current U.S.
Class: |
D13/162 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/158-178,184,199,110
;D14/197 ;361/380,383,390-395,399,412,415,417,686,687,733,752
;364/926.2,949,DIG.2 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Gandy; James
Assistant Examiner: Matta; Cathron B.
Attorney, Agent or Firm: Frishauf, Holtz, Goodman, Langer
& Chick, P.C.
Description
FIG. 1 is a front perspective view of the modular housing for
electrical circuits;
FIG. 2 is a rear perspective view of the unit of FIG. 1;
FIG. 3 is a front view of the unit of FIG. 1;
FIG. 4 is a top view of the unit of FIG. 1;
FIG. 5 is a left side view of the unit of FIG. 1;
FIG. 6 is a right side view of the unit of FIG. 1;
FIG. 7 is a bottom view of the unit of FIG. 1; and,
FIG. 8 is a rear view of the unit of FIG. 1.
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