U.S. patent number D401,829 [Application Number D/067,278] was granted by the patent office on 1998-12-01 for diamond abrasive saw blade.
This patent grant is currently assigned to Sankyo Diamond Industrial Co., Ltd.. Invention is credited to Shuichi Hariu.
United States Patent |
D401,829 |
Hariu |
December 1, 1998 |
Diamond abrasive saw blade
Claims
The ornamental design for a diamond abrasive saw blade, as shown
and described.
Inventors: |
Hariu; Shuichi (Kouza-gun,
JP) |
Assignee: |
Sankyo Diamond Industrial Co.,
Ltd. (Ebina, JP)
|
Appl.
No.: |
D/067,278 |
Filed: |
February 11, 1997 |
Foreign Application Priority Data
|
|
|
|
|
Dec 3, 1996 [JP] |
|
|
8-36534 |
Dec 3, 1996 [JP] |
|
|
8-36535 |
|
Current U.S.
Class: |
D8/70 |
Current International
Class: |
0803 |
Field of
Search: |
;D8/20,70
;D15/133,138,139 ;30/307,347,355,388,390 ;83/663,676,835 ;125/15,18
;451/259 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Primary Examiner: Spear; Robert M.
Attorney, Agent or Firm: Kubovcik & Kubovcik
Description
FIG. 1 is a front view of the diamond abrasive saw blade;
FIG. 2 is a top view of the diamond abrasive saw blade, the bottom
view being identical thereto;
FIG. 3 is a side view of the diamond abrasive saw blade, the
opposite side view being a mirror image thereof;
FIG. 4 is a cross-section of the diamond abrasive saw blade taken
along 4--4 in FIG. 1;
FIG. 5 is an enlarged view of part 5--5 of the cross-section of the
diamond abrasive saw blade shown in FIG. 4 and shows the
electrodeposited diamonds on the periphery of the saw blade;
FIG. 6 is an enlarged view of part 6--6 of the cross-section of the
diamond abrasive saw blade shown in FIG. 4 and shows the
electrodeposited diamonds on the periphery of the saw blade;
and,
FIG. 7 is a rear view of the diamond abrasive saw blade.
* * * * *