Housing for electronic components

Description

FIG. 1 is a perspective view of a housing for electronic components showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a front elevation view thereof;

FIG. 5 is a rear elevation view thereof;

FIG. 6 is a right side elevational view thereof; and,

FIG. 7 is a left side elevational view thereof.

Claims

The ornamental design for a housing for electronic components, as shown and described.

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Inventors:	Tucker; Russell L. (San Ramon, CA), McCall; Mark S. (Santa Rosa, CA), Lovina; Bernabe R. (Benecia, CA)
Assignee:	Next Level Communications (Rohnert Park, CA)
Appl. No.:	D/059,667
Filed:	May 2, 1996

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Current U.S. Class:	D14/240; D13/184
Current International Class:	1403
Field of Search:	;D14/140,142,240,100,107,114,242,256 ;D13/184,146,147,133 ;385/134,135,147 ;361/736,801 ;439/76.1,676 ;379/419,420,428,440,441,442,399,418

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References Cited [Referenced By]

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U.S. Patent Documents

D304193	October 1989	Lotz
D305225	December 1989	Komatsu
D318266	July 1991	Matsuzaki
D322604	December 1991	Komatsu
D332598	January 1993	Kikuta et al.
D334921	April 1993	Basara et al.
D373770	September 1996	James et al.
D375295	November 1996	Derocher et al.
D375938	November 1996	Muller et al.
4812004	March 1989	Biederstedt et al.
5285515	February 1994	Milanowski et al.
5432682	July 1995	Giehl
5546282	August 1996	Hill et al.

Primary Examiner: Asch; Jeffrey
Attorney, Agent or Firm: Skjerven, Morrill, MacPherson, Franklin & Friel