Piezolectric conversion type semiconductor device

Description

FIG. 1 is a front elevational view of a piezoelectric conversion type semiconductor device, showing our new design;

FIG. 2 is a right side elevational view thereof; the opposite side being an identical thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a front elevational view of a second embodiment of the piezoelectric conversion type semiconductor device;

FIG. 7 is a right side elevational view thereof; the opposite side being a mirror image thereof;

FIG. 8 is a rear elevational view thereof;

FIG. 9 is a top plan view thereof;

FIG. 10 is a bottom plan view thereof;

FIG. 11 is a front elevational view of a third embodiment of the piezoelectric conversion type semiconductor device;

FIG. 12 is a right side elevational view thereof; the opposite side being an identical thereof;

FIG. 13 is a rear elevational view thereof;

FIG. 14 is a top plan view thereof;

FIG. 15 is a bottom plan view thereof;

FIG. 16 is a front elevational view of a fourth embodiment of the piezoelectric conversion type semiconductor device;

FIG. 17 is a right side elevational view thereof; the opposite side being a mirror image thereof;

FIG. 18 is a rear elevational view thereof;

FIG. 19 is a top plan view thereof; and,

FIG. 20 is a bottom plan view thereof.

Claims

The ornamental design for a piezoelectric conversion type semiconductor device, as show and described.

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Inventors:	Takizawa; Takashi (Kawasaki, JP), Ito; Tatsuya (Akita, JP), Nishida; Hiroshi (Akita, JP)
Assignee:	Fujikura Ltd. (Tokyo, JP)
Appl. No.:	D/067,087
Filed:	March 4, 1997

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Foreign Application Priority Data

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Sep 9, 1996 [JP]			8-26572
Sep 9, 1996 [JP]			8-26572

Current U.S. Class:	D13/182; D13/101
Current International Class:	1303
Field of Search:	;D13/101,123,125,182 ;73/721 ;257/416-418 ;338/4,42

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References Cited [Referenced By]

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U.S. Patent Documents

D318646	July 1991	Karbassi
D330363	October 1992	Inoi
5031462	July 1991	Lam
5184107	February 1993	Maurer
5459351	October 1995	Bender

Other References

One chip integrated pressure sensor catalog published Apr. 1, 1992. . Motorola catalog of pressure sensor device data published Jan. 1, 1994..

Primary Examiner: Gandy; James
Assistant Examiner: Matta; Cathon B.
Attorney, Agent or Firm: Laff, Whitesel, Conte & Saret, Ltd.