Configurable multi-product electronics enclosure

Antonczak , et al. February 18, 1

Patent Grant D378081

U.S. patent number D378,081 [Application Number D/008,431] was granted by the patent office on 1997-02-18 for configurable multi-product electronics enclosure. This patent grant is currently assigned to Sun Microsystems, Inc.. Invention is credited to James G. Ammon, Michael J. Antonczak, Michael S. Dann, Paul S. Montgomery, Herbert H. F. Pfeifer, Philip G. Yurkonis.


United States Patent D378,081
Antonczak ,   et al. February 18, 1997

Configurable multi-product electronics enclosure

Claims

The ornamental design for a configurable multi-product electronics enclosure, as shown and described.
Inventors: Antonczak; Michael J. (Aptos, CA), Yurkonis; Philip G. (Campbell, CA), Dann; Michael S. (Mountain View, CA), Montgomery; Paul S. (San Francisco, CA), Pfeifer; Herbert H. F. (San Francisco, CA), Ammon; James G. (San Jose, CA)
Assignee: Sun Microsystems, Inc. (Mountain View, CA)
Appl. No.: D/008,431
Filed: May 10, 1993

Current U.S. Class: D13/184
Field of Search: ;D13/184 ;D14/107,101 ;361/724,725,727,728,729

References Cited [Referenced By]

U.S. Patent Documents
D273865 May 1984 Caven et al.
D299651 January 1989 Preussner
D301137 May 1989 Treptow et al.
D325584 April 1992 Ando
D328593 August 1992 Hutton
D329426 September 1992 Hutton
D337770 July 1993 Johnson
D341132 November 1993 Hui
D342724 December 1993 Yurkonis et al.
5119497 June 1992 Freige et al.
5251106 October 1993 Hui

Other References

Japanese application 758798 filed Jan. 1985. .
SPARCstation 10 marketing brochure. Printed Nov. 1992..

Primary Examiner: Sincavage; Joel
Attorney, Agent or Firm: Basinski; Erwin J.

Description



FIG. 1 is a front and upper right perspective view of a configurable multi-product electronics enclosure showing the first embodiment of our new design;

FIG. 2 is a front elevation view of a configurable multi-product electronics enclosure showing the second embodiment our new design. All other plan and elevation views are the same as the first embodiment;

FIG. 3 is a front elevation view of the first embodiment;

FIG. 4 is a front elevation view of a configurable multi-product electronics enclosure showing the third embodiment our new design. All other plan and elevation views are the same as the first embodiment;

FIG. 5 is a is a right side elevation view of the first embodiment, the left side being a mirror image;

FIG. 6 is a is a rear elevation view of the first embodiment;

FIG. 7 is a rear elevation view of a configurable multi-product electronics enclosure showing the fourth embodiment our new design. All other plan and elevation views are the same as the first embodiment;

FIG. 8 is a top plan view of the first embodiment;

FIG. 9 is a bottom plan view of the first embodiment;

FIG. 10 is a rear and upper left perspective view of the first embodiment; and,

FIG. 11 is a rear and upper left perspective view of the fourth embodiment.

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