Overmolded housing for an interface cable

Rak , et al. September 10, 1

Patent Grant D373567

U.S. patent number D373,567 [Application Number D/040,946] was granted by the patent office on 1996-09-10 for overmolded housing for an interface cable. Invention is credited to William E. Fenton, Roman P. Rak.


United States Patent D373,567
Rak ,   et al. September 10, 1996

Overmolded housing for an interface cable

Claims

The ornamental design for an overmolded housing for an interface cable, as shown and described.
Inventors: Rak; Roman P. (Delta, British Columbia, CA), Fenton; William E. (Surrey, British Columbia, CA)
Appl. No.: D/040,946
Filed: June 30, 1995

Current U.S. Class: D13/133
Field of Search: ;D13/133,137,138,146,147 ;439/597,600,606,682,692

References Cited [Referenced By]

U.S. Patent Documents
D332251 January 1993 Meinel
D356293 March 1995 Riley et al.
3020518 February 1962 Camping et al.
4445742 May 1984 Fullam
4585290 April 1986 Knickerbocker et al.
4704091 November 1987 Owens et al.
Primary Examiner: Sincavage; Joel
Attorney, Agent or Firm: Bethards; Charles W. Buford; Kevin A.

Description



FIG. 1 is a perspective view showing a top, right, and front side of a preferred embodiment of our new design for an overmolded housing for an interface cable in accordance with the present invention;

FIG. 2 is a left side elevational view thereof;

FIG. 3 is a bottom plan view thereof; and,

FIG. 4 is a rear elevational view thereof.

The broken line showing throughout the drawing figures is included for the purpose of illustrating environmental structure only and forms no part of the claimed design.

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