Electronic instrument housing

Peroni December 26, 1

Patent Grant D365529

U.S. patent number D365,529 [Application Number D/028,313] was granted by the patent office on 1995-12-26 for electronic instrument housing. This patent grant is currently assigned to LaFrance Corporation. Invention is credited to Peter A. Peroni.


United States Patent D365,529
Peroni December 26, 1995

Electronic instrument housing

Claims

The ornamental design for an electronic instrument housing, as shown and described.
Inventors: Peroni; Peter A. (Pottstown, PA)
Assignee: LaFrance Corporation (Philadelphia, PA)
Appl. No.: D/028,313
Filed: October 28, 1994

Current U.S. Class: D10/103; D13/184
Field of Search: ;D13/162,164,184 ;D10/80,103 ;D14/100,107,114,240 ;361/679,748,752

References Cited [Referenced By]

U.S. Patent Documents
D260762 September 1981 Peroni
D265989 August 1982 Harris et al.
D278999 May 1985 Zimmerman
D297633 September 1988 Peroni

Other References

Enclosures on p. 66 of Allied Electronics .COPYRGT.1990. .
Enclosures on p. 69 of Allied Electronics .COPYRGT.1990..

Primary Examiner: Sincavage; Joel
Attorney, Agent or Firm: Connolly & Hutz

Description



FIG. 1 is a front elevational view of an electronic instrument housing showing my new design, the rear elevational view being identical;

FIG. 2 is a top plan view thereof;

FIG. 3 is a right side elevational view thereof, the left side elevational view being identical;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a cross-sectional view in elevational taken along the line 5--5 of FIG. 2;

FIG. 6 is a front elevational view of a second embodiment of my electronic instrument housing similar to FIG. 1 with the right side elevational view and the bottom view being the same as in FIGS. 3 and 4 except for the proportions thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a front elevational view of a third embodiment of my electronic instrument housing of this invention similar to FIG. 1 with the side elevational view and the bottom view being the same as FIGS. 3 and 4, except for the proportions thereof;

FIG. 9 is a top plan view thereof;

FIG. 10 is a front elevational view of a fourth embodiment of my form of electronic instrument housing in accordance with this invention similar to FIG. 1 wherein the front panel shows a reveal around its edge, all other figures corresponding to FIGS. 2-4 thereof; and,

FIG. 11 is a partial cross-sectional view in elevation taken along the line 11--11 of FIG. 10 to show the front panel reveal thereof.

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