Semi-conductor element with terminal casing

Shimizu , et al. November 21, 1

Patent Grant D364385

U.S. patent number D364,385 [Application Number D/028,487] was granted by the patent office on 1995-11-21 for semi-conductor element with terminal casing. This patent grant is currently assigned to Fuji Electric Co., Ltd.. Invention is credited to Rikihiro Maruyama, Takao Nagasawa, Akira Nakahira, Tomio Shimizu, Toshifusa Yamada.


United States Patent D364,385
Shimizu ,   et al. November 21, 1995

Semi-conductor element with terminal casing

Claims

The ornamental design for a semi-conductor element with terminal casing, as shown.
Inventors: Shimizu; Tomio (Kanagawa, JP), Nakahira; Akira (Kanagawa, JP), Maruyama; Rikihiro (Kanagawa, JP), Yamada; Toshifusa (Kanagawa, JP), Nagasawa; Takao (Kanagawa, JP)
Assignee: Fuji Electric Co., Ltd. (Kanagawa, JP)
Appl. No.: D/028,487
Filed: September 16, 1994

Foreign Application Priority Data

May 11, 1994 [JP] 6-13276
Current U.S. Class: D13/182; D13/146
Field of Search: ;D13/182 ;174/52.4,52.5 ;257/690 ;361/752,798,820

References Cited [Referenced By]

U.S. Patent Documents
4218724 August 1980 Kaufman
4750031 June 1988 Miller et al.
5347160 September 1994 Sutrina
5410450 April 1995 Iida et al.
Primary Examiner: Sincavage; Joel
Attorney, Agent or Firm: Sughrue, Mion, Zinn, Macpeak & Seas

Description



FIG. 1 is a perspective view of the front, top and right side of a semi-conductor element with terminal casing showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a rear elevational view thereof; and,

FIG. 7 is a bottom plan view thereof.

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