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Patent applications and USPTO patent grants for Nakahira; Akira.The latest application filed is for "semiconductor device with reduced amount of sealing resin".
Patent | Date |
---|---|
Semiconductor device with reduced amount of sealing resin Grant 6,011,302 - Nakahira January 4, 2 | 2000-01-04 |
Semi-conductor element with terminal casing Grant D364,384 - Shimizu , et al. November 21, 1 | 1995-11-21 |
Semi-conductor element with terminal casing Grant D364,385 - Shimizu , et al. November 21, 1 | 1995-11-21 |
Roll for use in heat treating furnace and method of producing the same Grant 5,161,306 - Nakahira , et al. November 10, 1 | 1992-11-10 |
Roll for use in heat treating furnace and method of producing the same Grant 5,070,587 - Nakahira , et al. December 10, 1 | 1991-12-10 |
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