Spring clip for retaining thermal contact between an electronic device package and a heat sink

Description

FIG. 1 is a front perspective view of a spring clip for retaining thermal contact between an electronic device package and a heat sink showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a side elevational view thereof, the opposite side view being a mirror image of the view of FIG. 5; and,

FIG. 6 is a bottom plan view of my spring clip for retaining thermal contact between an electronic device package and a heat sink.

Claims

The ornamental design disclosed for a spring clip for retaining thermal contact between an electronic device package and a heat sink, as shown and described.

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Inventors:	Smithers; Matthew C. (Lewisville, TX)
Assignee:	Thermalloy, Inc. (Dallas, TX)
Appl. No.:	D/013,459
Filed:	September 24, 1993

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Current U.S. Class:	D13/179; D8/395
Field of Search:	;D13/173,179 ;D8/349,354,395 ;361/704,707,717 ;165/80.3,185 ;174/16.3 ;24/458

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References Cited [Referenced By]

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U.S. Patent Documents

D275178	August 1984	Yeater
D301334	May 1989	Dupasquier et al.
D307540	May 1990	McCarthy
2724882	November 1955	Poupitch
4964198	October 1990	McCarthy
5068764	November 1991	Bland et al.
5138524	August 1992	Smithers

Primary Examiner: Sincavage; Joel
Attorney, Agent or Firm: Kanz; Jack A.