Heat dissipating device for a semiconductor package

Description

FIG. 1 is a front view of an embodiment of the heat dissipating device;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a perspective view thereof;

FIG. 6 is a sectional view taken along section line 6--6 in FIG. 2;

FIG. 7 is a sectional view taken along section line 7--7 in FIG. 2; and,

FIG. 8 is a view of the heat dissipating device shown in FIG. 1 attached to a semiconductor package, the latter being shown by broken lines only as it does not form any part of the claimed design.

Claims

The ornamental design for a heat dissipating device for a semiconductor package, as shown and desscribed.

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Inventors:	Itoh; Satomi (Hyogo, JP)
Assignee:	Itoh Research & Development Laboratory Co., Ltd. (Osaka, JP)
Appl. No.:	07/933,504
Filed:	August 21, 1992

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Foreign Application Priority Data

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Mar 4, 1992 [JP]			4-6201

Current U.S. Class:	D13/179
Field of Search:	;D13/179,182 ;437/902 ;165/104.33 ;257/720 ;174/15.2,16.3 ;361/386

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References Cited [Referenced By]

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U.S. Patent Documents

4079410	March 1978	Schierz
4268850	May 1981	Lazarek et al.
4494171	January 1985	Bland et al.
4546405	October 1985	Hultmark et al.
4942497	July 1990	Mine et al.
5113315	May 1992	Capp et al.

Primary Examiner: Burke; Wallace R.
Assistant Examiner: Sincavage; Joel
Attorney, Agent or Firm: Fasse; W. G. Kane, Jr.; D. H.