U.S. patent number D327,425 [Application Number 07/493,719] was granted by the patent office on 1992-06-30 for blister package.
This patent grant is currently assigned to Canon Kabushiki Kaisha. Invention is credited to Tomohiko Hamada, Nobuyuki Kuwabara.
United States Patent |
D327,425 |
Hamada , et al. |
June 30, 1992 |
Blister package
Claims
The ornamental design for a blister package, as shown and
described.
Inventors: |
Hamada; Tomohiko (Kamakura,
JP), Kuwabara; Nobuyuki (Tokyo, JP) |
Assignee: |
Canon Kabushiki Kaisha (Tokyo,
JP)
|
Appl.
No.: |
07/493,719 |
Filed: |
March 14, 1990 |
Foreign Application Priority Data
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Sep 14, 1989 [JP] |
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1-33784 |
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Current U.S.
Class: |
D9/415 |
Field of
Search: |
;D9/415,418,341,416,337,414,457
;206/461-471,45.31,45.34,806,564 |
References Cited
[Referenced By]
U.S. Patent Documents
Other References
Packaging, May 1989, Back Cover, bottom left of the Page
Packages..
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Primary Examiner: Shooman; Theodore M.
Assistant Examiner: Deshmukh; Prabhakar
Attorney, Agent or Firm: Fitzpatrick, Cella, Harper &
Scinto
Description
FIG. 1 is a front elevational view of a blister package showing our
new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a right side elevational view thereof, the left side
elevational view being a mirror image thereof; and,
FIG. 5 is a perspective view thereof.
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