Package for adhesives and the like

Yeske June 12, 1

Patent Grant D308485

U.S. patent number D308,485 [Application Number 07/214,150] was granted by the patent office on 1990-06-12 for package for adhesives and the like. Invention is credited to Mervin D. Yeske.


United States Patent D308,485
Yeske June 12, 1990

Package for adhesives and the like

Claims

The ornamental design for a package for adhesives and the like, as shown and described.
Inventors: Yeske; Mervin D. (New Berlin, WI)
Appl. No.: 07/214,150
Filed: June 30, 1988

Current U.S. Class: D9/415
Field of Search: ;D9/415,418,341,342,345,347,420,424 ;206/83,461-471,813,214,45.31,45.34,45.33,45.11

References Cited [Referenced By]

U.S. Patent Documents
D292776 November 1987 Cugley
D297914 October 1988 Goodman
D298741 November 1988 Didia
3463309 August 1969 Szostek
4545487 October 1985 Asmus
4687129 August 1987 Cugley
Primary Examiner: Ansher; Bernard
Assistant Examiner: Deshmukh; Prabhakar
Attorney, Agent or Firm: Mann; Philip P. Rechtin; Michael D.

Description



FIG. 1 is a perspective view of a package for adhesives and the like showing my new design;

FIG. 2 is a right side elevation view thereof; the left side elevation being a mirror image;

FIG. 3 is a rear side elevation thereof; and

FIG. 4 is a bottom plan view thereof.

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