Housing for interface module
Kies , et al. September 30, 1
U.S. patent number D285,926 [Application Number 06/561,383] was granted by the patent office on 1986-09-30 for housing for interface module. This patent grant is currently assigned to Rockwell International Corp.. Invention is credited to Henry J. Kies, William P. Loris.
| United States Patent | D285,926 |
| Kies , et al. | September 30, 1986 |
Housing for interface module
Claims
The ornamental design for a housing for interface module, substantially as shown and described.
| Inventors: | Kies; Henry J. (Darien, IL), Loris; William P. (Bloomingdale, IL) |
|---|---|
| Assignee: | Rockwell International Corp.
(El Segundo, CA) |
| Appl. No.: | 06/561,383 |
| Filed: | December 14, 1983 |
| Current U.S. Class: | D14/357 |
| Field of Search: | ;D14/100,107,114 ;D13/40,41 ;174/50,52 ;361/331,332,380,381,390,391,392,394 |
References Cited [Referenced By]
U.S. Patent Documents
| D220764 | May 1971 | Ortega et al. |
| D246368 | November 1977 | Barnich et al. |
| 4090091 | May 1978 | Brown et al. |
| 4217624 | August 1980 | Tuck |
Other References
|
Computer Design, 11-1980, p. 84, Bizcomp intelligent modem 1022.. |
Primary Examiner: Lucas; Susan J.
Attorney, Agent or Firm: Patti; Carmen B. Sewell; V. Lawrence Hamann; H. Fredrick
Description
FIG. 1 is a top view of the housing for interface module, showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a side view thereof;
FIG. 4 is a perspective view thereof;
FIG. 5 is a view opposite that shown in FIGS. 3 and 4; and
FIG. 6 is a rear view thereof.
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