Combined integrated circuit package carrier and socket assembly

Jones , et al. November 1, 1

Patent Grant D271197

U.S. patent number D271,197 [Application Number 06/236,795] was granted by the patent office on 1983-11-01 for combined integrated circuit package carrier and socket assembly. This patent grant is currently assigned to Robinson-Nugent, Inc.. Invention is credited to James A. Emerson, James C. Jones.


United States Patent D271,197
Jones ,   et al. November 1, 1983

Combined integrated circuit package carrier and socket assembly

Claims

The ornamental design for a combined integrated circuit package carrier and socket assembly, as shown and described.
Inventors: Jones; James C. (Floyd County, IN), Emerson; James A. (Washington County, IN)
Assignee: Robinson-Nugent, Inc. (New Albany, IN)
Appl. No.: 06/236,795
Filed: February 23, 1981

Current U.S. Class: D13/182; D13/147
Current International Class: D1303
Field of Search: ;D13/12,24,99 ;361/403,412,415 ;339/18R,18B,17C,17M,75MF,176 ;206/335 ;D9/414,424,456

References Cited [Referenced By]

U.S. Patent Documents
D251422 March 1979 Thomas et al.
3999827 December 1976 Hutchison et al.
4080032 March 1978 Cherian et al.
Foreign Patent Documents
2254620 May 1973 DE
Primary Examiner: Lucas; Susan J.
Attorney, Agent or Firm: Woodard, Weikart, Emhardt & Naughton

Description



FIG. 1 is a top plan view of a combined integrated circuit package carrier and socket assembly, showing our new design.

FIG. 2 is a left side elevational view thereof on a reduced scale.

FIG. 3 is a bottom plan view thereof on a reduced scale.

FIG. 4 is a right side elevational view thereof on a reduced scale.

FIG. 5 is a front elevational view thereof on a reduced scale.

FIG. 6 is a rear elevational view thereof on a reduced scale.

FIG. 7 is an isometric view thereof on a reduced scale looking generally downward.

FIG. 8 is an isometric view thereof on a reduced scale looking generally upward.

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