U.S. patent number D271,197 [Application Number 06/236,795] was granted by the patent office on 1983-11-01 for combined integrated circuit package carrier and socket assembly.
This patent grant is currently assigned to Robinson-Nugent, Inc.. Invention is credited to James A. Emerson, James C. Jones.
United States Patent |
D271,197 |
Jones , et al. |
November 1, 1983 |
Combined integrated circuit package carrier and socket assembly
Claims
The ornamental design for a combined integrated circuit package
carrier and socket assembly, as shown and described.
Inventors: |
Jones; James C. (Floyd County,
IN), Emerson; James A. (Washington County, IN) |
Assignee: |
Robinson-Nugent, Inc. (New
Albany, IN)
|
Appl.
No.: |
06/236,795 |
Filed: |
February 23, 1981 |
Current U.S.
Class: |
D13/182;
D13/147 |
Current International
Class: |
D1303 |
Field of
Search: |
;D13/12,24,99
;361/403,412,415 ;339/18R,18B,17C,17M,75MF,176 ;206/335
;D9/414,424,456 |
References Cited
[Referenced By]
U.S. Patent Documents
|
|
|
D251422 |
March 1979 |
Thomas et al. |
3999827 |
December 1976 |
Hutchison et al. |
4080032 |
March 1978 |
Cherian et al. |
|
Foreign Patent Documents
Primary Examiner: Lucas; Susan J.
Attorney, Agent or Firm: Woodard, Weikart, Emhardt &
Naughton
Description
FIG. 1 is a top plan view of a combined integrated circuit package
carrier and socket assembly, showing our new design.
FIG. 2 is a left side elevational view thereof on a reduced
scale.
FIG. 3 is a bottom plan view thereof on a reduced scale.
FIG. 4 is a right side elevational view thereof on a reduced
scale.
FIG. 5 is a front elevational view thereof on a reduced scale.
FIG. 6 is a rear elevational view thereof on a reduced scale.
FIG. 7 is an isometric view thereof on a reduced scale looking
generally downward.
FIG. 8 is an isometric view thereof on a reduced scale looking
generally upward.
* * * * *