Heat releasing plate for mounting semiconductor components
Asanuma September 7, 1
U.S. patent number D266,081 [Application Number 06/154,982] was granted by the patent office on 1982-09-07 for heat releasing plate for mounting semiconductor components. This patent grant is currently assigned to Showa Aluminum Kabushiki Kaisha. Invention is credited to Yoshihiko Asanuma.
| United States Patent | D266,081 |
| Asanuma | September 7, 1982 |
Heat releasing plate for mounting semiconductor components
Claims
The ornamental design for heat releasing plate for mounting semiconductor components, as shown and described.
| Inventors: | Asanuma; Yoshihiko (Tochigi, JP) |
|---|---|
| Assignee: | Showa Aluminum Kabushiki Kaisha
(Osaka, JP) |
| Appl. No.: | 06/154,982 |
| Filed: | May 30, 1980 |
Foreign Application Priority Data
| Mar 31, 1980 [TW] | 6930609 | |||
| Current U.S. Class: | D13/179 |
| Current International Class: | D1303 |
| Field of Search: | ;165/8R,8A,8B,8D ;357/81 ;174/16HS ;D13/23 |
References Cited [Referenced By]
U.S. Patent Documents
| 2949283 | August 1960 | Smith |
| 3163207 | December 1964 | Schultz |
| 3180404 | April 1965 | Nelson et al. |
| 3187812 | June 1965 | Staver |
Attorney, Agent or Firm: Armstrong, Nikaido, Marmelstein & Kubovcik
Description
FIG. 1 is a front view of the heat releasing plate for mounting semi-conductor components showing the new design;
FIG. 2 is a plan view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a right side view thereof; and
FIG. 5 is a sectional view taken on line 5--5 of FIG. 2.
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