Seal member for semiconductor production apparatus

Description

FIG. 1 is a perspective view of a seal member for semiconductor production apparatus, showing our new design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a right side elevation view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is a cross-sectional view thereof;

FIG. 9 is an enlarged cross-sectional view of a portion thereof; and,

FIG. 10 is an enlarged cross-sectional view of a portion thereof in a condition of use.

The broken lines shown in FIG. 10 are for the purposes of illustrating environmental structure and form no part of the claimed design.

Claims

CLAIM The ornamental design for a seal member for semiconductor production apparatus, as shown and described.

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Inventors:	Tsuji; Kazuaki (Tokyo, JP), Sakurai; Takafumi (Santa Clara, CA)
Applicant:	Name City State Country Type Valqua, Ltd. Tokyo N/A JP
Assignee:	Valqua, Ltd. (Tokyo, JP)
Family ID:	73823947
Appl. No.:	D/743,419
Filed:	July 21, 2020

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Related U.S. Patent Documents

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	Application Number	Filing Date	Patent Number	Issue Date
	35507137	Jan 21, 2019	D905761

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Foreign Application Priority Data

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Jul 24, 2018 [JP]			2018-016130
Jul 24, 2018 [JP]			2018-016131
Jul 24, 2018 [JP]			2018-016132

Current U.S. Class:	D15/7
Current CPC Class:	F16K51/02 20130101
Current International Class:	1503
Field of Search:	;D15/7,9,11,17,21,28,123,199 ;D23/269,356,259 ;D8/349 ;277/602-626 ;285/98,109,336,910,918

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References Cited [Referenced By]

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U.S. Patent Documents

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Foreign Patent Documents

	D127505		Feb 2009		TW
	D149670		Oct 2012		TW
	D163769		Oct 2014		TW
	D164826		Dec 2014		TW
	D164827		Dec 2014		TW
	D166713		Mar 2015		TW
	D180129		Dec 2016		TW
	D183422		Jun 2017		TW

Primary Examiner: Chilcot; Richard E
Attorney, Agent or Firm: The Webb Law Firm

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